When your test floor faces frequent project changes, the Advantest T2000 delivers the flexibility you need.

Its modular architecture allows easy reconfiguration of test resources. It handles SoC, mixed-signal and power device tests, covering both wafer sort and final package test stages. Multi-site parallel testing maximizes throughput while keeping measurement precision consistent.

Engineered for automotive chips, MCUs and sensors, this proven platform works reliably whether for R&D validation or high-volume mass production.

Advantest T2000 Modular SoC and Mixed-Signal Semiconductor Test System

T2000 Platform Overview

Item	Representative Capability
Equipment type	Modular semiconductor automatic test equipment
Primary applications	SoC, digital, mixed-signal, PMIC, automotive, industrial and CMOS image sensor testing
System architecture	Configurable modular platform
Mainframe scalability	From compact air-cooled configurations to large liquid-cooled systems
Test-head capacity	Approximately 13 to 52 instrument slots, configuration dependent
Maximum channel capacity	Up to approximately 8,192 channels
Digital performance	Available modules from 500 Mbps to 8 Gbps
Parallel testing	Multi-DUT capability based on device and module configuration
Development environment	Rapid Development Kit, simulator and debugging tools
Multi-user development	Up to eight users on supported configurations
Cooling	Air-cooled or liquid-cooled, depending on system
Production integration	Prober, handler and factory-interface integration, configuration dependent

Main Semiconductor Test Applications

Device category	Typical test requirements
SoC devices	Digital functional test, scan, memory, power and mixed-signal measurement
Microcontrollers	Digital I/O, embedded memory, analog peripherals and device power
FPGA devices	High-density digital channels, scan patterns and interface testing
PMIC devices	Voltage, current, power sequencing and parametric measurement
Automotive ICs	High-voltage, high-current and mixed-signal testing
Industrial devices	Functional, power, analog and interface verification
ADC and DAC devices	DC parameters, linearity, waveform generation and digitization
Audio and video ICs	High-dynamic-range analog measurement
High-speed interface ICs	Serial and parallel interface testing
CMOS image sensors	Image capture, image processing, digital and analog measurement
Consumer semiconductor devices	Digital, power, analog and multi-domain functional testing

Scalable System Configuration

The Advantest T2000 platform can be scaled for different stages of semiconductor product development.

Production stage	Typical system objective	Configuration considerations
Engineering development	Initial test-program creation and device characterization	Compact mainframe and essential instrument modules
Device qualification	Expanded measurement coverage and reliability testing	Additional digital, analog, power or parametric resources
Pilot production	Repeatable testing with moderate parallelism	Production interface and multi-site capability
Medium-volume production	Improved throughput and lower test cost	Higher channel density and expanded test-head capacity
High-volume manufacturing	Maximum parallelism and production efficiency	Large mainframe, multiple modules and optimized DUT interface
Product-family support	Testing several related device types	Reusable software and flexible module allocation

Representative T2000 Instrument Modules

The following table shows representative T2000 module families. An individual tester may contain only some of these modules.

Module	Module type	Representative function
1.6GDME	High-density digital module	Up to 256 I/O channels and operation up to approximately 1.6 Gbps
500MDM	Digital module	Up to 128 I/O channels and operation up to approximately 500 Mbps
8GDM	High-speed digital module	Up to 96 I/O channels and operation up to approximately 8 Gbps
DPS32A	Device power supply	32 channels with up to approximately 1 A per channel
DPS90A	Device power supply	64-channel power resource with selectable current functions
DPS192A	High-density device power supply	96 channels with different current-capability functions
DPS150AE	Enhanced high-current power supply	High-current device supply with parallel-operation capability
PMU32E	Parametric measurement unit	Voltage/current generation and measurement for DC and linearity testing
MMXHE	High-voltage mixed-signal module	Digital, PMU, AWG, digitizer and high-voltage measurement functions
MFHPE	Floating high-power module	Floating VI resources for power supply, load and dynamic measurement
MPCM	Cross-point matrix module	Flexible routing, Kelvin measurement and parallel contact testing
GPWGD	AWG and digitizer module	General-purpose analog waveform generation and measurement
4.8GICAP	Image-capture module	High-speed CMOS image sensor capture for supported MIPI interfaces

Module names and specifications can vary according to hardware generation and system revision.

Representative Technical Summary

Specification item	Representative information
Platform type	Modular SoC semiconductor test system
System scale	Approximately 13 to 52 instrument slots
Maximum channel count	Up to approximately 8,192 channels
Cooling options	Air cooling or liquid cooling
Digital module speeds	Up to approximately 8 Gbps, module dependent
High-density digital channels	Up to 256 channels per selected digital module
Test applications	SoC, MCU, FPGA, PMIC, automotive, mixed-signal and CMOS image sensors
Multi-user capability	Up to eight users on supported systems
Parallel testing	Device- and configuration-dependent
Image sensor capture	Up to approximately 4.8 Gbps with supported modules
Factory use	Engineering, characterization, wafer test and final test applications
Software	RDK, simulator, debugging and optimization tools
External integration	Prober, handler and factory-interface dependent

These specifications describe the T2000 platform and available module families. They do not represent the guaranteed configuration of every individual machine.