Used & Refurbished Die Bonder Machines

ASMPT AD838L Automatic Die Bonder

ASMPT AD838L automatic die bonder. ±10 μm @ 3σ (±15 μm with up-look), ~14,000 UPH. Dies 0.15–2.03 mm, substrates up to 300 × 100 mm. Up-look PR, flip chip, dual dispense.

Updated: 2026-10-15

View Details Request Quote

Used ASMPT AD832i Epoxy Die Bonder | 8-Inch

Refurbished ASMPT AD832i epoxy die bonder for 8-inch wafer packaging. Built for small leadframe packages, fine epoxy dispensing and high-mix IC assembly. Pre-tested, ready for mid-volume semiconductor packaging lines.

Updated: 2026-10-13

View Details Request Quote

ASMPT SIPLACE CA2 Chip Assembly and SMT Placement Machine

ASMPT SIPLACE CA2 hybrid placer: 76k cph SMT, 54k cph bare die, ±10μm accuracy, 50-wafer capacity—one machine for SiP, no taping step required.

Updated: 2026-10-13

View Details Request Quote

Used ASMPT AD8312Plus 12-Inch Epoxy Die Bonder

Used ASMPT AD8312Plus 12-inch epoxy die bonder buying guide. Covers wafer size verification, iDispense/iTouch module checks, dispense system wear, sub-model differences and inspection priorities before purchase.

Updated: 2026-10-13

View Details Request Quote

Used ASMPT AD280 Plus High-Precision Die Bonder

Used ASMPT AD280 Plus die bonder selection guide: ±3μm accuracy, look-through alignment, chip/substrate compatibility, and key checks for used equipment condition.

Updated: 2026-10-13

View Details Request Quote

Used ASMPT AD211Plus-II Eutectic Die Bonder

Before buying a used AD211Plus-II, know its specs, its void-rate limits, the parts that wear out, and the jobs it was built for.

Updated: 2026-10-13

View Details Request Quote

Used ASMPT AD830 Plus High-Speed Epoxy Die Bonder

Used ASMPT AD830 Plus high-speed epoxy die bonder for LED, optocoupler and sensor packaging. 0.16s/chip, 12+ months warranty. Inspected and ready to ship.

Updated: 2026-10-13

View Details Request Quote

Used ASMPT AD838L-Plus Automatic Die Bonder

Before buying a used ASMPT AD838L-Plus, check three things: option list, bond head wear, and local parts support. Full specs and application limits here.

Updated: 2026-10-13

View Details Request Quote

Used ASM AD50Pro Die Bonder | 50 ms Small-Die System

ASM AD50Pro small-die bonder handles 3 mil dies at a 50 ms cycle, with ±25µm @ 3σ placement and ±3° die angle. Linear motors, direct film feed, optional wafer handler.

Updated: 2026-10-13

View Details Request Quote

ASMPT SD8312 Soft Solder Die Bonder

ASMPT SD8312 Soft Solder Die Bonder for power semiconductor soft solder die attach. Built around controlled atmosphere, closed-loop thermal force control, supports 12-inch wafer & high-density lead frame bonding for ...

Updated: 2026-10-13

View Details Request Quote

ASM AD838 Automatic High-Speed Epoxy Die Bonder

ASM AD838 automatic epoxy die bonder with up to 17,200 UPH, 8-inch wafer handling and 100 mm substrate capability. Check used configuration, price and availability.

Updated: 2026-10-13

View Details Request Quote

Used ASMPT AD420XL Mini LED Die Bonder

AD420XL: a Mini LED COB die bonder covering backlight modules and P0.4+ RGB direct-view displays. 500×600mm substrate, 12-ring wafer handling, ±15μm accuracy.

Updated: 2026-10-13

View Details Request Quote

Besi Datacon 2200 APM Multi-Chip Die Bonder

From wafer to finished multi-chip assembly on one Besi Datacon 2200 APM. Review the configuration, throughput and installed options.

Updated: 2026-10-13

View Details Request Quote

Besi Esec 2100 hS High-Speed Epoxy Die Bonder

Besi Esec 2100 hS: up to 18,500 UPH, 120 ms cycle time with liquid cooling, and 20 µm @ 3σ standard accuracy (15 µm in High Accuracy Mode). High-speed epoxy die bonder for dies from 0.25 mm to 20 mm, wafers from 4 to 12 ...

Updated: 2026-10-13

View Details Request Quote

Used MRSI-705 Die Bonders

Inspected used MRSI-705 die bonders. Pre-owned high precision die attach system for photonics & eutectic bonding. Fully calibrated and tested for NPI and pilot packaging runs.

Updated: 2026-10-12

View Details Request Quote

Used ASM AD800 Automatic Die Bonder

Used ASM AD800 die bonder buying guide: process compatibility, accuracy and throughput checks, machine inspection priorities, and long-term ownership costs, with a verification checklist for production line decisions.

Updated: 2026-10-12

View Details Request Quote

ASMPT SIPLACE CA4 Chip Assembly and Die Placement Machine

ASMPT SIPLACE CA4 configurable chip assembly machine supporting bare die placement, flip chip and SMD assembly with four wafer/feeder positions.

Updated: 2026-10-12

View Details Request Quote

Besi Datacon 2200 EVO Multi-Chip Die Bonder

Besi Datacon 2200 EVO die bonder with up to four working heads for die attach and flip chip. Every machine is configured differently—confirm specs and stock before you buy.

Updated: 2026-10-12

View Details Request Quote

Used ASM AD819-LD & AD819-PD Die Bonders

Eutectic or dispensing? Two used ASM AD819 models cover both routes. LD uses gold-tin eutectic, PD uses adhesive bonding, with a common platform and vision system.

Updated: 2026-10-09

View Details Request Quote