ASMPT ORCAS Semiconductor Molding System
Fan-out/fan-in wafer-level and panel-level packaging — 300mm wafers, 340×340mm panels. Mold direction switchable, liquid...
Semiconductor Encapsulation Equipment
Used Molding Machines
We stock used molding systems from TOWA, Besi Fico, ASMPT, APIC YAMADA and other platforms — transfer molding, compression molding and C-Molding systems for leadframe, substrate, wafer and panel packaging. The machine that fits your line depends on four things: the package format, the molding method, the resin system and the production volume. Most used-molding-machine purchases that go wrong fail at one of these four points — the model matches, the machine arrives, and then the mold chase or tooling turns out not to fit the target package. Tell us your requirements and we'll shortlist the systems that actually work on your line.
Package First
Start With the Package Format and Resin Flow
We've seen buyers order a molding machine based on the model number alone, then discover the mold chase doesn't fit their leadframe strip — and finding a replacement chase for a discontinued platform can take months. The same molding platform is not automatically suitable for every semiconductor package. Leadframe products, substrate-based arrays, power modules, wafers and panels place different demands on mold size, clamp force, resin delivery, release film, handling and post-mold cleaning.
Tell us what is entering the mold and what the finished package should look like. This is usually more useful than starting with machine tonnage alone.
For wire-bonded devices, resin flow must also be reviewed against wire length, loop profile and package density. For wafer- or panel-level molding, uniform resin distribution and warpage control become more important. C-Molding currently accounts for 23% of global molding equipment revenue, but is projected to reach nearly 40% by 2032.
Package Route
Typical Method
What Must Be Confirmed
Leadframe IC Packages
QFN, SOP, DIP, discrete and related molded packages.
Transfer Molding
Leadframe size, cavity layout, pellet delivery, wire-sweep risk, chase and tooling compatibility.
Substrate & MAP Packages
BGA, MAP-QFN, SiP and multi-die package arrays.
Transfer or Compression
Substrate dimensions, mold thickness, resin flow length, exposed features and singulation route.
Wafer & Panel-Level Packaging
FOWLP, FIWLP, EWLP, PLP and advanced package structures.
Compression Molding
Wafer or panel size, dispense pattern, resin form, thickness uniformity, release film and warpage control.
Power, Sensor & Optical Products
Thick devices, heat-spreader exposure, modules, sensors and LED-related products.
Application-Specific
Device height, thermal path, exposed metal, liquid or granular resin, mold pressure and demolding method.
Available Equipment
Available Used Molding Machines
Two molding machines with the same model name can have very different capabilities. The installed press, mold interface, handling modules, software and included tooling matter more than the platform name alone. Review the current inventory, then send us your package and mold requirements for a configuration check.
Need a specific TOWA, Besi Fico, ASMPT or another molding platform? Send the complete model name, package type and preferred condition for a focused availability check.
Besi Fico FML Molding System
Besi Fico FML molds wafers and panels. Up to 305mm wafers, 300×340mm panels. Overmolded and exposed die both run in the ...
Besi AMS-X Leadframe Molding System
Besi AMS-X leadframe molding system, up to 240 leadframes/hour, about 30% faster than comparable tools. Four independent...
TOWA Y1E4120 Transfer Molding System
TOWA Y1E4120 transfer molding system. 120-ton clamp force, frames up to 78 × 260 mm. Modular design — add or remove pres...
TOWA CPM1180 Large-Panel Compression Molding System
TOWA CPM1180 large-panel compression molding. Handles up to 660×620mm panels and 18" (Φ450mm) wafers. Cavity-down d...
ASMPT IDEALmold 3G Automatic Molding System
The ASMPT IDEALmold 3G molds strip and reel substrates, leadframes up to 100 × 300 mm. Start with one press, scale to fo...
TOWA CPM1080 WLP/PLP Compression Molding System
The TOWA CPM1080 WLP/PLP compression molding system supports both granular and liquid resins and is compatible with 300m...
Besi MMS-X Semiconductor Molding System
Besi MMS-X is the manual version of the AMS-X molding system. Strips up to 125 × 300 × 10 mm, 180-ton clamp force, 150 m...
Besi Fico AMS-LM Molding System
Besi Fico AMS-LM large-substrate molding system, strips up to 102 × 280 mm. Mk3 handles SIP, dual-side, MEMS. 600 kN cla...
ASMPT IDEALmold R2R Molding System
Pre-owned ASMPT IDEALmold R2R semiconductor molding system. Ask about line configuration, mold compatibility, machine co...
Besi Fico AMS-i Automatic Molding System
Pre-owned Besi Fico AMS-i automatic molding system for semiconductor packages. Ask about configuration, molds, condition...
Molding Method
Transfer Molding or Compression Molding?
The difference is mainly how the resin reaches the package. This affects resin movement around the device, mold construction, material use, package size and the type of product the machine is designed to handle. T-Molding still holds the majority of global revenue for mature packages, while C-Molding is gaining share in FOWLP, FOPLP and MUF applications.
Transfer Molding
The mold closes first, then heated resin is transferred through runners and gates into the package cavities before curing.
- Common for leadframe, substrate and established IC package formats
- Requires review of runner, gate, cavity and pellet or resin delivery configuration
- Wire sweep, flash, short fill and resin bleed must be controlled through mold and process conditions
- Actual package compatibility depends on the installed mold chase, tooling and handling system
Compression Molding
Resin is dispensed or placed into the mold area and compressed around the device, reducing the need for long transfer paths.
- Often considered for wafer-level, panel-level, thin-package and advanced packaging applications
- Can reduce resin flow around delicate structures, depending on the mold and process design
- Requires confirmation of wafer or panel size, resin form, dispense route and release-film handling
- Thickness uniformity, void control, warpage and demolding remain important selection points
Mold Quality
Select the Machine Around the Defects You Need to Prevent
We've seen buyers focus on press force during machine selection, then discover the vacuum system can't evacuate the mold fast enough and the package ends up with voids. Output is not determined by press force alone. Resin behavior, mold temperature, vacuum, clamp balance, package layout, wire geometry, release condition and post-mold handling all affect the finished package.
When replacing an existing molding machine, share current defects and package samples. They often reveal more than a general request for a “higher-capacity” system.
RiskWire Sweep
Resin flow can move long or closely spaced bond wires during encapsulation.
Review flow path, wire loop and fill conditions
RiskVoids & Incomplete Fill
Air removal, vacuum, preheat, resin condition and feature geometry influence filling.
Confirm vacuum, dispense and cure route
RiskFlash & Resin Bleed
Mold contact, clamp balance, film, chase condition and process pressure affect overflow.
Inspect mold interface and clamp system
RiskWarpage & Thickness Variation
Large substrates, wafers and panels require controlled pressure and resin distribution.
Match package size, mold flatness and resin pattern
RiskSticking & Demold Damage
Release film, mold surface, cure condition and eject sequence affect package removal.
Verify release-film and demolding configuration
Production Mode
Match Automation to Product Mix and Output
Manual, modular and fully automatic molding systems serve different production environments. The right choice depends on package changeover, loading format, mold exchange, resin handling, traceability and the volume expected from each product family.
Manual or Laboratory System
Useful for process development, package trials, low-volume production and applications where operators load the package, resin and tooling directly.
- Flexible for experiments and frequent product changes
- Operator involvement is high
- Confirm mold size, clamp force and safety configuration
Modular or Semi-Automatic System
Combines controlled molding with selected automation for loading, preheating, resin handling or unloading.
- Useful for mixed production and staged automation
- Change kits and mold exchange time become important
- Can be integrated with separate handling modules
Fully Automatic Molding Line
Designed for repeatable high-volume encapsulation with automated loading, resin management, molding, unloading and production data handling.
- Best evaluated as a complete line, not only as a press
- Package logistics and upstream/downstream interfaces matter
- Software, recipes and factory integration must be confirmed
Used Equipment Check
Verify the Actual Molding System, Not Only the Model Name
We've seen buyers purchase a used molding machine based on a model number, then discover the hydraulic system needs a full rebuild or the heater zones are out of spec — issues that cost more than the initial savings. A used semiconductor molding machine may have been configured for one package family, resin system or factory layout. Before quotation, the installed press, mold interface, handling units, software, utilities and included accessories should be reviewed as one system.
Ask AboutWhat We Need to Confirm
Machine Identity
Complete model, serial number, production year, manufacturer records and current location.
Molding Method
Transfer or compression platform, press capacity, chamber or module arrangement and supported resin route.
Package Handling
Leadframe, substrate, strip, wafer or panel format; loader, preheater, shuttle, unloader and buffer configuration.
Mold & Tooling Interface
Chase dimensions, mold height, clamp arrangement, release-film system, change kit and included tooling.
Software & Controls
Controller version, recipes, language, licenses, traceability functions and factory communication options.
Condition & Refurbishment
Press alignment, heaters, vacuum, hydraulic or servo system, maintenance history, replaced parts and test scope.
Utilities & Delivery
Power, air, vacuum, exhaust, cooling, machine dimensions, dismantling, export packing and installation plan.
Common Questions
Questions Before Choosing a Molding Machine
Start with the package, resin and production route. A model can then be checked against the actual mold, handling and process configuration required.
What does a semiconductor molding machine do?
It encapsulates semiconductor chips, interconnects and package structures with cured resin to provide mechanical protection, environmental isolation and the final molded package form.
What is the difference between transfer molding and compression molding?
Transfer molding moves heated resin through runners and gates into a closed mold. Compression molding places or dispenses resin in the mold area and compresses it around the device. The suitable method depends on package architecture, resin flow requirements and production format.
Can one molding machine process every IC package?
No. Compatibility depends on mold dimensions, clamp force, resin delivery, chase and tooling, package handling, software and the options installed on the actual machine.
Which molding method is used for wafer-level or panel-level packaging?
Compression molding is widely considered for many wafer- and panel-level applications, but the final choice still depends on wafer or panel size, resin form, dispense method, target thickness, release-film handling and warpage limits.
What causes wire sweep during semiconductor molding?
Wire sweep can result from resin flow acting on bond wires. Wire length, loop geometry, package layout, flow path, viscosity, fill speed, temperature and mold design all influence the risk.
What should be checked when buying a used molding machine?
Confirm the exact model, year, molding method, press and mold interface, handling modules, software, vacuum and heating systems, included tooling, maintenance history, operating condition, utilities and refurbishment scope.
What information is needed for a quotation?
Send the target package, strip or wafer size, molding method if known, resin type, mold dimensions, output requirement, preferred manufacturer or model, required condition, quantity and destination country.
Request a Used Molding Machine Quote
Send the package format, resin, molding method, mold or chase information, output requirement and preferred machine condition. We'll confirm availability, mold compatibility and configuration completeness within 4 business hours.