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DISCO DAD3230 Dicing Saw

DISCO DAD3230 dicing saw for wafer singulation and precision cutting. Check the spindle, chuck table, options, condition and availability.

DISCO DAD3230 Dicing Saw EQUIPMENT IMAGE
Configuration Review Model and installed options
New / Used Supply Subject to project availability
Global Delivery Destination-based assessment
Technical RFQ Package and process matching

The DISCO DAD3230 is a high-expandability single-spindle dicing saw, designed for processing up to 6-inch wafers and diverse hard substrates. It is well-suited for singulating silicon, glass, ceramics and compound semiconductor workpieces in optoelectronic and power device packaging lines.

Fitted with a 1.5kW high-speed spindle ranging from 3,000 to 40,000 rpm, the system comes standard with auto-alignment, auto-focus and auto kerf inspection. These vision functions continuously monitor cutting streets to deliver precise cutting trajectories and reduce edge chipping. The spindle shaft-lock mechanism also simplifies blade replacement, cutting tool change downtime.

Built with expandable mechanical architecture, this model supports optional custom configurations for special workpiece requirements. The intuitive touchscreen GUI enables straightforward recipe setup and process tuning, making it a flexible and reliable wafer singulation solution for mid-volume production and process development.

DISCO DAD3230 automatic single-spindle dicing saw

DISCO DAD3230 Machine Information

ManufacturerDISCO
ModelDAD3230
Equipment TypeAutomatic single-spindle dicing saw
Maximum Workpiece SizeUp to Φ6 inches under the standard model specification
Special Workpiece Support150 × 150 mm or 220 × 160 mm workpieces with the applicable special configuration
X-Axis Cutting Range160 mm standard or 220 mm with the applicable optional configuration
Y-Axis Cutting Range162 mm
Feed Speed Range0.1–500 mm/sec
Spindle Output1.5 kW
Spindle Speed Range3,000–40,000 min⁻¹
Alignment FunctionsAutomatic alignment with autofocus and automatic kerf-check functions according to the model specification
Machine DimensionsApproximately 730 × 900 × 1,670 mm
Machine WeightApproximately 600 kg
Production StatusDiscontinued by the manufacturer; DAD3231 is listed as the successor model
ConditionPre-owned precision dicing equipment
Delivery ScopeBased on the quotation and confirmed equipment list
ShippingExport packing and worldwide delivery