The DISCO DAD324 is a high-performance single-spindle dicing saw designed for wafer singulation in semiconductor packaging. Primarily for 6-inch wafer processing, it is widely used for power devices, discrete chips and optoelectronic component separation.
Featuring high-speed spindle and advanced pattern recognition, the system offers precise kerf alignment and cutting depth regulation. It effectively reduces edge chipping and substrate cracking during cutting, protecting the integrity of functional chips and securing stable yield.
The equipment comes with intuitive recipe management and built-in wafer cleaning modules. Its durable mechanical design enables continuous mass production, making it a trusted workhorse for wafer dicing processes
DISCO DAD324 Machine Information
| Manufacturer | DISCO |
|---|---|
| Model | DAD324 |
| Equipment Type | Compact automatic single-spindle dicing saw |
| Maximum Workpiece Size | Up to Φ6 inches under the standard model specification |
| Special Workpiece Support | Up to 150 × 150 mm with the applicable special configuration |
| X-Axis Cutting Range | 160 mm |
| X-Axis Feed Speed | 0.1–800 mm/sec |
| Y-Axis Cutting Range | 162 mm |
| Spindle Output | 2.0 kW at 40,000 min⁻¹ |
| Spindle Speed Range | 3,000–40,000 min⁻¹ |
| Standard Functions | Automatic alignment, autofocus, automatic kerf check and Non-Contact Setup |
| Standard Blade Diameter | 55.56 mm |
| Maximum Workpiece Thickness | Up to 1.2 mm under the applicable standard blade specification |
| Machine Dimensions | Approximately 490 × 870 × 1,670 mm |
| Machine Weight | Approximately 420 kg |
| Condition | Pre-owned precision dicing equipment |
| Delivery Scope | Based on the quotation and confirmed equipment list |
| Shipping | Export packing and worldwide delivery |
