The DISCO DAD324 fully automatic compact dicing saw perfectly combines automatic wafer dicing capabilities with a space-saving design. It accommodates workpieces up to 150 mm in diameter and is equipped with a single-axis, 2.0 kW spindle capable of speeds up to 40,000 rpm. With a machine width of only 490 mm, it is ideally suited for installation in facilities with limited production space.
The system utilizes servo-driven X, Y, and Z axes to support high-speed movement, while features such as automatic alignment, autofocus, and kerf inspection streamline setup and enhance process consistency. This model is suitable for dicing semiconductor wafers and precision cutting of small electronic components.
DISCO DAD324 Machine Information
| Manufacturer | DISCO |
|---|---|
| Model | DAD324 |
| Equipment Type | Compact automatic single-spindle dicing saw |
| Maximum Workpiece Size | Up to Φ6 inches under the standard model specification |
| Special Workpiece Support | Up to 150 × 150 mm with the applicable special configuration |
| X-Axis Cutting Range | 160 mm |
| X-Axis Feed Speed | 0.1–800 mm/sec |
| Y-Axis Cutting Range | 162 mm |
| Spindle Output | 2.0 kW at 40,000 min⁻¹ |
| Spindle Speed Range | 3,000–40,000 min⁻¹ |
| Standard Functions | Automatic alignment, autofocus, automatic kerf check and Non-Contact Setup |
| Standard Blade Diameter | 55.56 mm |
| Maximum Workpiece Thickness | Up to 1.2 mm under the applicable standard blade specification |
| Machine Dimensions | Approximately 490 × 870 × 1,670 mm |
| Machine Weight | Approximately 420 kg |
| Condition | Pre-owned precision dicing equipment |
| Delivery Scope | Based on the quotation and confirmed equipment list |
| Shipping | Export packing and worldwide delivery |
