The DISCO DAD3241 is a compact single-spindle dicing saw developed for precision cutting of compatible semiconductor wafers, electronic components, glass, ceramics and other materials. It supports workpieces up to 8 inches, while 200 × 200 mm square workpieces require the applicable JIG chuck table and special machine configuration.
It adopts high-speed spindle technology paired with accurate dicing street alignment. The system maintains stable cutting depth control, minimizing chipping and cracking on brittle wafer surfaces to preserve device yield. Built-in cleaning and inspection functions help detect cutting anomalies during continuous operation.
Its robust mechanical structure supports long-hour mass production. Flexible recipe programming accommodates various wafer thicknesses and blade types, making it a versatile core tool for semiconductor packaging front-end processes.
DISCO DAD3241 Machine Information
| Manufacturer | DISCO |
|---|---|
| Model | DAD3241 |
| Equipment Type | Compact single-spindle manual dicing saw |
| Maximum Workpiece Size | Up to Φ8 inches under the standard model specification |
| Square Workpiece Support | Up to 200 × 200 mm with the applicable JIG chuck table and special configuration |
| X-Axis Cutting Range | 210 mm |
| X-Axis Cutting Speed | 0.1–800 mm/sec |
| Y-Axis Cutting Range | 210 mm |
| Y-Axis Index Step | 0.0001 mm |
| Z-Axis Maximum Stroke | 32.2 mm |
| Spindle Output | 1.8 kW at 60,000 min⁻¹ |
| Spindle Speed Range | 6,000–60,000 min⁻¹ |
| Spindle Rated Torque | 0.29 N·m |
| Machine Dimensions | Approximately 650 × 950 × 1,670 mm |
| Machine Weight | Approximately 550 kg |
| Condition | Pre-owned precision dicing equipment |
| Delivery Scope | Based on the quotation and confirmed equipment list |
| Shipping | Export packing and worldwide delivery |
