The DISCO DAD3241 is a compact, single-spindle dicing saw that supports workpieces up to 8 inches in diameter; however, cutting 200 × 200 mm square workpieces requires a dedicated chuck table and specific machine configuration.
High-speed spindle technology and precise kerf alignment ensure stable cutting depth control and minimize chipping and cracking on brittle wafer surfaces, thereby enhancing device yield. Integrated cleaning and inspection functions facilitate the detection of dicing anomalies during continuous operation.
Its robust mechanical structure supports sustained, high-volume production. Flexible processing parameter (recipe) programming accommodates various wafer thicknesses and blade types, making it a versatile and critical piece of equipment for semiconductor front-end packaging processes.
DISCO DAD3241 Machine Information
| Manufacturer | DISCO |
|---|---|
| Model | DAD3241 |
| Equipment Type | Compact single-spindle manual dicing saw |
| Maximum Workpiece Size | Up to Φ8 inches under the standard model specification |
| Square Workpiece Support | Up to 200 × 200 mm with the applicable JIG chuck table and special configuration |
| X-Axis Cutting Range | 210 mm |
| X-Axis Cutting Speed | 0.1–800 mm/sec |
| Y-Axis Cutting Range | 210 mm |
| Y-Axis Index Step | 0.0001 mm |
| Z-Axis Maximum Stroke | 32.2 mm |
| Spindle Output | 1.8 kW at 60,000 min⁻¹ |
| Spindle Speed Range | 6,000–60,000 min⁻¹ |
| Spindle Rated Torque | 0.29 N·m |
| Machine Dimensions | Approximately 650 × 950 × 1,670 mm |
| Machine Weight | Approximately 550 kg |
| Condition | Pre-owned precision dicing equipment |
| Delivery Scope | Based on the quotation and confirmed equipment list |
| Shipping | Export packing and worldwide delivery |
