The DISCO DFD6341 is a Fully Automatic Dicing Saw designed for high-speed singulation of semiconductor wafers and various brittle substrates. Equipped with high-rigidity air-bearing spindle and high-resolution vision alignment, it delivers reliable cutting performance for silicon, glass, ceramic and compound materials.
It uses precision blade cutting with adjustable spindle speed and cutting feed rate. Built-in optical alignment automatically recognizes wafer marks for kerf positioning, while real-time cutting monitoring suppresses chipping and cracking. Integrated DI water cooling removes cutting debris and reduces thermal damage during processing.
Its multi-function chuck table supports automatic wafer loading and unloading for continuous batch production. Flexible recipe storage enables fast parameter switching between different substrate types. The system balances throughput and cutting quality, meeting stable mass-production requirements for discrete chips, sensors and advanced packaging.
DISCO DFD6341 Technical Specifications
| Parameter | Description |
|---|---|
| Equipment Type | Fully automatic dicing saw |
| Manufacturer | DISCO Corporation |
| Model | DFD6341 |
| Wafer Size | Φ8 inch (200mm) |
| Spindle Type | Facing dual spindle |
| X Axis Cutting Range | 210mm |
| Cutting Speed | 0.1 - 1000 mm/s |
| Index Step | 0.0001mm |
| Position Accuracy | Within 0.002mm / 210mm |
| Blade Support | Φ2 inch / Φ3 inch blade |
| Spindle Speed | Up to 80,000 rpm (high speed configuration) |
| Machine Weight | Approx. 1,500kg |
