DISCO DFD6341 is a fully automatic dual-spindle dicing saw for Φ200 mm wafers. Its X-axis return speed reaches up to 1,000 mm/s. The reduced distance between dual spindles cuts cycle time for dual-blade cutting processes.
DISCO DFD6341 Fully Automatic Dual Spindle Dicing Saw Key Features:
Breakthrough Throughput: Incorporating throughput enhancement technology developed for the Φ300mm DFD6362, the DFD6341 achieves X-axis return speeds up to 1,000 mm/s — a 10× improvement over conventional models. Optimized acceleration/deceleration expands the distance traveled at maximum speed, substantially improving throughput.
Facing Dual Spindle Design: Significantly reduces processing time during dual cut operations by minimizing the distance between spindles.
Space-Saving Design: Footprint reduced by 3% compared to the DFD6340. Four accessories — transformer, UPS, CO₂ injector, and booster pressure pump — can be integrated internally without expanding the machine footprint.
High-Speed Flash Alignment (Optional): Combines a xenon flash lamp and high-speed CCD shutter to perform alignment without stopping the chuck table, further reducing alignment time and increasing throughput.
For packaging fabs running 200mm wafer singulation, low throughput and inconsistent kerf accuracy are common bottlenecks. The DISCO DFD6341 is a dual-spindle fully automatic dicing saw built exclusively for 8-inch wafer cutting, bringing high-speed axis technology adapted from DISCO’s 300mm platform to resolve cycle-time constraints while maintaining stable cutting quality for high-volume die separation.
Many older dual-spindle dicers suffer from slow axis return rates and long indexing intervals, limiting lot throughput. The DFD6341 upgrades X-axis return speed up to 1000 mm/s and optimizes acceleration and deceleration profiles for all motion axes. Paired with a reduced gap between opposing spindles, dual-blade cutting cycle times drop noticeably for standard wafer dicing jobs. Its compact footprint is roughly 3% smaller than the prior DFD6340 model, with integrated space for transformer, UPS, CO₂ injector and booster pump without expanding the machine base.
DISCO DFD6341 Spindle & Motion Spec Comparison
| Parameter | 1.2 kW / 1.8 kW High-Speed Spindle | 2.2 kW High-Torque Spindle | Production Benefit |
|---|---|---|---|
| X-axis Cutting Speed | 0.1–1000 mm/s | 0.1–1000 mm/s | Fast return stroke shortens cycle time for high-volume lots |
| Travel Range (X/Y) | 210 mm | 210 mm | Full coverage for 8-inch wafer processing |
| Y-axis Index Step | 0.0001 mm | 0.0001 mm | Fine indexing for narrow kerf and small die layouts |
| Positioning Accuracy | ≤0.002 mm over 210 mm | ≤0.002 mm over 210 mm | Minimizes kerf deviation and die chipping risk |
| Z-axis Repeatability | 0.001 mm | 0.001 mm | Stable depth control for partial cut and full cut processes |
| Spindle Torque | 0.19 N·m (1.2kW) / 0.29 N·m (1.8kW) | 0.7 N·m | 2.2kW version handles tougher materials like glass, ceramics |
