DISCO DFL7341 Fully Automatic Laser Saw handles 8-inch (Φ200 mm) wafer singulation with Stealth Dicing technology. It executes fully automated cassette-to-cassette workflow, from wafer loading, pre-alignment, laser internal modification to unloading, minimizing manual intervention in wafer processing lines.
Unlike conventional blade dicing or ablation laser cutting, the machine creates modified layers inside the substrate rather than cutting through the surface. The dry process generates almost no debris and skips post-cleaning steps, ideal for moisture-sensitive MEMS, silicon microphones and devices vulnerable to particle contamination. It delivers low-chipping separation on brittle materials including sapphire, lithium tantalate, SiC and GaN.
Built-in height sensing and wafer contour recognition compensate for warped thin wafers, maintaining consistent laser focus across uneven substrates. Narrow kerf capability increases die count per wafer, lifting material utilization for LED substrates and compound semiconductor production. The platform supports SDBG and SDTT process recipes, offering flexible integration into different chip singulation flows.
We supply refurbished DISCO DFL7341 laser saw with full system inspection, functional testing and extended after-sales maintenance coverage. Contact us to check machine availability, process validation and spare parts support.
Specifications at a Glance
| Item | Specification |
|---|---|
| Processing method | Stealth Dicing™ (laser stealth dicing) |
| Maximum workpiece size | Φ200mm (8 inches) |
| Applicable material | Pure silicon wafers (no oxide/metal coverage in dicing streets) |
| Wafer thickness range | 0.1–0.7mm |
| Minimum die size | 0.5mm or above |
| Laser wavelength | Approximately 1300nm |
| X-axis straightness accuracy | ≤0.002mm/210mm |
| Y-axis positioning accuracy | ≤0.003mm/210mm |
| Z-axis repeatability | 0.001mm |
| X-axis cutting speed | 1–1000mm/s |
| System dimensions | 950×1732×1800mm |
| System weight | Approximately 1800kg |
