The DISCO DFL7341 is a Fully Automatic Laser Dicing System optimized for high-precision singulation of hard and brittle semiconductor substrates. Featuring DISCO’s exclusive Stealth Dicing™ technology, it specializes in processing silicon carbide (SiC), sapphire, GaN and other wide-bandgap materials that are difficult to cut with traditional blade saws.
This advanced laser dicing equipment adopts an internal modified-layer processing principle, achieving completely dry dicing without water contact or surface abrasion. It effectively eliminates chipping, cracks and process debris, greatly improving die yield. Intelligent wafer height detection and automatic position calibration ensure stable and consistent cutting results for thin or warped wafers.
DISCO DFL7341 Technical Specifications
| Parameter | Description |
|---|---|
| Equipment Type | Fully automatic laser saw |
| Manufacturer | DISCO Corporation |
| Model | DFL7341 |
| Processing Method | Stealth Dicing™ |
| Maximum Wafer Size | Φ200mm |
| X Axis Processing Range | 210mm |
| Y Axis Processing Range | 210mm |
| X Axis Speed | 1 - 1000 mm/s |
| Position Accuracy | Within 0.003mm / 210mm |
| Z Axis Resolution | 0.0001mm |
| Equipment Size | 950 × 1732 × 1800 mm |
| Weight | Approx. 1800 kg |
Specifications are based on DISCO published product information.
DISCO DFL7341 vs DFD6341
| Equipment | Technology | Main Application |
|---|---|---|
| DFD6341 | Blade Dicing | Silicon wafer cutting |
| DFL7341 | Laser Stealth Dicing | SiC, Sapphire, MEMS |
DFD6341 focuses on traditional semiconductor wafer singulation, while DFL7341 is designed for advanced materials requiring ultra-low damage processing.
