K&S Katalyst Flip Chip Mounter reaches placement speed up to 15K UPH while maintaining positioning accuracy below 3μm. Multi-noise configuration supports rapid die pick and transfer, keeping stable alignment during long continuous production cycles.
Built-in thermal drift compensation and automatic calibration reduce deviations between nozzles. It handles tiny micro LED die reliably, lowering placement errors and cut waste. The guided recipe wizard simplifies program changeover, bringing flexible operation and stable output for display packaging lines.
Technical Specification (Typical Range)
| Parameter | Specification |
|---|---|
| System Type | High-speed flip chip / mass transfer mounter |
| Placement Accuracy | Sub-micron to ±2 μm @ 3σ (process dependent) |
| Bonding Methods | TCB / Eutectic / Advanced mass transfer |
| Target Die Size | Ultra-small dies (micro LED / RF / photonics) |
| Substrate Compatibility | Display backplanes / organic laminates / ceramic carriers |
| Throughput | Optimized for high-volume display manufacturing |
Contact engineering team for evaluation or quotation support.