High throughput and precise alignment are critical for FO-WLP and FC-BGA mass production. The SHIBAURA TFC-9000 adopts a dual-head design to deliver stable high-speed flip chip assembly.
It achieves local alignment accuracy at 5μm, with global alignment up to 7μm and throughput exceeding 6000 UPH. The system supports die sizes up to 20×20mm and substrates as large as 330×330mm, compatible with DAF, C4 and thermal compression bonding processes. Optional flux transfer and thin die pickup modules expand process flexibility.
Consistent placement performance keeps assembly defects low during long production cycles. It handles high-volume wafer level packaging tasks efficiently to boost overall fab output.
Technical Specifications (Typical Configuration)
Performance values vary depending on process recipe, tooling setup, and device characteristics.
| Parameter | Typical Description |
|---|---|
| System Type | Fully automatic flip chip bonding platform |
| Placement Accuracy | ±2 μm to ±5 μm @ 3σ (process dependent) |
| Supported Processes | Flip chip mass reflow / Thermocompression bonding (TCB) |
| Wafer Size Support | Up to 8-inch or 12-inch (configuration dependent) |
| Substrate Compatibility | Laminated substrates, ceramic carriers, silicon interposers |
| Throughput | Varies depending on alignment complexity and bonding mode |