The Yamaha YSH20 is a hybrid flip-chip placer that brings Yamaha's surface mount technology into die-level assembly. Part of the i-CUBE series, it handles flip chips and standard SMD components on the same platform, which makes it useful for lines that need both capabilities without dedicating separate machines to each.
Core Technical Features
Dual-head placement architecture. The YSH20 runs dual mount heads with a multiple nozzle design. Flip-chip placement reaches up to 4,500 UPH under optimal conditions — a throughput level that matters when cycle time drives line economics.
Bump-level vision recognition. A high-resolution chip recognition camera inspects the electrical connection bumps on the flip chip surface before placement. It checks for defective or missing bumps and compensates placement based on actual bump positions. With Yamaha standard components, mounting accuracy reaches ±10 μm (3σ).
Wafer and component flexibility. The system takes 6, 8, and 12-inch wafers with expand ring and θ angle correction, plus waffle tray and tape reel feeding. Flip chips can range from 0.6 × 0.6 mm to 18 × 18 mm, with bump diameters of 60 μm or larger and pitches of 110 μm or more.
Specification Summary
| Item | Parameter |
|---|---|
| Mounting accuracy | ±10 μm (3σ) |
| Mounting capability | 4,500 UPH (0.8 sec/unit) |
| Applicable PCB | L50 × W30 mm to L250 × W200 mm |
| Flip chip size | 0.6 × 0.6 mm to 18 × 18 mm |
| Wafer supply | 6/8/12 inch flat ring |
| External dimensions | L1,400 × W1,820 × H1,515 mm (main unit) |
| Weight | Approx. 2,470 kg (main unit) |
The YSH20 fits production environments that need flip-chip placement with bump inspection and SMT-compatible material handling. As a used unit, it provides access to this hybrid placement capability without the lead time of new equipment.
