High-precision die placement directly governs packaging yield. The Yamaha YSH20 leverages mature SMT platform technology to deliver reliable flip chip and hybrid component placement.
Built with dual mounting heads and high-resolution multi-camera vision, it achieves placement accuracy up to ±10μm (3σ) and throughput of 4,500 UPH. It supports die sizes ranging from 0.6×0.6mm to 18×18mm, compatible with MEMS, memory, ASIC and small communication module packaging.
Robust frame construction maintains stable performance through long continuous runs. Flexible configuration supports wafer feeding and substrate size adjustment, reducing changeover downtime for mixed product batches.
Technical Specifications
| Item | Specification |
|---|---|
| System Type | High-speed SMT-based die placement system |
| Placement Accuracy | ±15 μm to ±30 μm @ 3σ |
| Motion System | Dual-gantry high-speed architecture |
| Bonding Method | Epoxy / adhesive die attach |
| Supported Devices | LED dies, small ICs, discrete components |
| Substrate Type | Organic PCB, leadframe, SMT substrates |
| Throughput | High-UPH SMT-style production |