The Axcelis GSD200 represents a premium solution for high-current ion implantation, tailored for high-volume, cost-sensitive semiconductor manufacturing. As an upgraded iteration of the classic GSD series, this industry-grade implanter excels in high-dose doping processes and is fully compatible with mainstream 200 mm wafer production lines, covering diverse doping requirements for discrete devices and power semiconductors.
Engineered with advanced beam stabilization and precision dose calibration systems, the equipment delivers ultra-uniform ion implantation with minimal process deviation. Its optimized rotary batch processing structure effectively eliminates channeling effects, while built-in anti-pollution and anti-charging modules greatly reduce wafer surface defects. The whole system maintains outstanding operational stability under long-duration mass production scenarios.
With superior compatibility, low maintenance consumption and extensive market verification, the Axcelis GSD200 is a highly cost-effective upgrade option. It perfectly meets fab capacity expansion and old-equipment replacement demands, reliably boosting production efficiency and product yield while lowering overall manufacturing operating costs.
Axcelis GSD200 Main Specifications
| Manufacturer | Axcelis Technologies |
|---|---|
| Model | GSD200 |
| Equipment Type | Batch High-Current Ion Implanter |
| Supported Wafer Sizes | 150 mm and 200 mm, according to the available equipment listing |
| Implant Current Class | High current |
| Wafer Processing Method | Batch implantation using a rotating wafer disk or end-station assembly, depending on configuration |
| Ion Source | Installed source type and source-head configuration must be confirmed |
| Extraction and Beamline | Configuration-dependent; voltage range and installed beamline components must be verified |
| Dopant Gas Configuration | Gas box, gas lines and approved dopant species must be confirmed from the available system |
| Wafer Handling | Cassette, aligner, robot and vacuum-transfer configuration must be inspected |
| Process Control | Recipe, beam monitoring and dose-control configuration depend on the installed controller |
| Condition | Used semiconductor equipment |
| Availability | Subject to current stock, inspection and configuration confirmation |
