The Axcelis GSD200 is associated with high-current ion implantation for semiconductor fabrication, particularly processes that require substantial dopant doses on 200 mm wafers. In power and discrete device manufacturing, implantation conditions influence junction formation, electrical characteristics and the consistency of the finished device.
Boron, phosphorus and arsenic are common dopants in this process category, with the selected species and implant recipe determined by the target device structure. Beam current, dose accuracy, wafer orientation and contamination control all contribute to process results. Batch handling can support production throughput, while the machine’s actual configuration determines its capabilities for specific implant steps.
For fabs maintaining established 200 mm lines, a GSD200 may be worth evaluating for continued high-dose implantation. Compatibility with existing recipes, the condition of the ion source and beamline, and the availability of technical support are important factors in determining its value as used equipment.
Axcelis GSD200 Main Specifications
| Manufacturer | Axcelis Technologies |
|---|---|
| Model | GSD200 |
| Equipment Type | Batch High-Current Ion Implanter |
| Supported Wafer Sizes | 150 mm and 200 mm, according to the available equipment listing |
| Implant Current Class | High current |
| Wafer Processing Method | Batch implantation using a rotating wafer disk or end-station assembly, depending on configuration |
| Ion Source | Installed source type and source-head configuration must be confirmed |
| Extraction and Beamline | Configuration-dependent; voltage range and installed beamline components must be verified |
| Dopant Gas Configuration | Gas box, gas lines and approved dopant species must be confirmed from the available system |
| Wafer Handling | Cassette, aligner, robot and vacuum-transfer configuration must be inspected |
| Process Control | Recipe, beam monitoring and dose-control configuration depend on the installed controller |
| Condition | Used semiconductor equipment |
| Availability | Subject to current stock, inspection and configuration confirmation |
