The Panasonic PSX307 Plasma Cleaning System leverages low-damage plasma surface treatment to eliminate residual organics and micro-contaminants on wafers and package substrates. Surface activation from plasma treatment effectively boosts adhesive strength for die bonding and underfill processes, reducing delamination risks in finished packages.
Its enclosed reaction chamber maintains uniform plasma distribution across the whole batch. Intuitive recipe storage and automated safety interlocks simplify daily operation, fitting well into semiconductor packaging lines that demand consistent surface quality and reliable long-run performance.
Panasonic PSX307 Machine Information
| Manufacturer | Panasonic |
|---|---|
| Model | PSX307 |
| Equipment Type | Plasma cleaning and surface-treatment system |
| Application | Surface preparation before compatible bonding, coating or electronic assembly processes |
| Condition | Pre-owned equipment |
| Process Compatibility | Determined by the product material, contamination, required result and actual machine configuration |
| Actual Configuration | Confirmed according to the specific machine available |
| Delivery Scope | Based on the quotation and confirmed equipment list |
| Support | Initial fault review, replacement-part matching and repair discussion |
| Shipping | Export packing and worldwide delivery |