For batch thermal processing of 6-inch wafers, the Thermco 5200 is a classic horizontal diffusion furnace widely adopted for oxidation, doping and LPCVD processes. Its long 1100mm flat temperature zone delivers stable thermal conditions across large wafer batches, ideal for discrete devices and power semiconductor manufacturing.
Precise gas delivery and closed-loop temperature regulation work together to minimize within-batch variation. Multiple tube configurations are available, letting you separate oxidation, diffusion and poly deposition processes on one platform. It handles high-volume batch processing reliably for mature-node fabrication.
This legacy furnace platform has a huge global installed base and readily available spare parts. It brings predictable thermal results at low ownership cost, a solid pick for fabs scaling up or replacing aging thermal batch equipment.
Thermco 5200 Main Specifications
| Manufacturer | Thermco Systems |
|---|---|
| Model | 5200 |
| Equipment Type | Horizontal Multi-Tube Diffusion Furnace |
| Maximum Substrate Size | Up to 150 mm |
| Platform Tube Configuration | Two to four process tubes, depending on installed system |
| Maximum Flat Zone | Up to 1,100 mm |
| Published Operating Range | 200–1,350°C, depending on heater and process configuration |
| Heating Zones | Three independently controlled furnace zones |
| Optional Ramp Rate | Up to 25°C per minute with the appropriate fast-ramp option |
| Optional Cooling Rate | Up to 20°C per minute with the appropriate fast-cooling option |
| Process Control | Thermco furnace control system; installed controller version must be confirmed |
| Condition | Used semiconductor equipment |
| Availability | Subject to current stock, tube configuration and inspection confirmation |
