As an upgraded version of the DFG8540, the DISCO DFG8541 semiconductor wafer grinding machine features an intuitive new GUI control system, intelligent error detection, and flexible multi-recipe processing capabilities, thereby enhancing operational efficiency and process stability.
The DISCO DFG8541 performs uniform coarse and fine grinding on standard silicon wafers and high-hardness silicon carbide wafers. Its precision mechanical design minimizes thickness variation, edge chipping, and subsurface damage, ensuring ultra-smooth, stress-controlled thinning for brittle, advanced materials.
DISCO DFG8541 Technical Specifications
| Parameter | Description |
|---|---|
| Equipment Type | Fully automatic wafer grinder |
| Manufacturer | DISCO Corporation |
| Model | DFG8541 |
| Wafer Size | Φ200mm (8 inch) |
| Chuck Table | 3 chuck tables |
| Grinding Axis | 2 axes |
| Grinding Method | In-feed grinding with wafer rotation |
| Grinding Wheel | Φ200mm diamond wheel |
| Spindle Output | 4.2 kW |
| Rotation Speed | 1,000 - 7,000 rpm |
| Applications | Si wafer, SiC wafer, semiconductor materials |
Specifications are based on DISCO published product information.
