The DISCO DFG8541 is a next-generation dual-spindle automatic wafer backgrinder, optimized for high-precision thinning of 8-inch and smaller wafers. As an upgraded successor to the DFG8540, it features an intuitive new GUI control system, intelligent error detection and flexible multi-recipe processing to enhance operational efficiency and process stability.
Engineered for difficult-to-process substrates, the machine delivers uniform coarse and fine grinding for both standard silicon and high-hardness SiC wafers. Its refined mechanical structure minimizes TTV, edge chipping and subsurface damage, ensuring ultra-smooth, stress-controlled thinning results for brittle advanced materials.
Widely deployed in power semiconductor and compound semiconductor manufacturing, it is ideal for wafer thinning before dicing and advanced packaging. Its compact footprint and energy-saving design also support cleanroom mass production and high-yield process development.
DISCO DFG8541 Technical Specifications
| Parameter | Description |
|---|---|
| Equipment Type | Fully automatic wafer grinder |
| Manufacturer | DISCO Corporation |
| Model | DFG8541 |
| Wafer Size | Φ200mm (8 inch) |
| Chuck Table | 3 chuck tables |
| Grinding Axis | 2 axes |
| Grinding Method | In-feed grinding with wafer rotation |
| Grinding Wheel | Φ200mm diamond wheel |
| Spindle Output | 4.2 kW |
| Rotation Speed | 1,000 - 7,000 rpm |
| Applications | Si wafer, SiC wafer, semiconductor materials |
Specifications are based on DISCO published product information.
