200mm thin wafers run through the DISCO DFG8560 automatic back grinder before dicing. Total thickness variation stays steady and edge chipping drops, so fragile wafers sustain less damage.
Two spindles carry out rough grinding then fine grinding in one unbroken cycle. Thickness readings feed back constantly and alter grind settings as work proceeds. Material comes away evenly, with fewer wafer cracks. Washing and drying happen right after thinning. Wafers leave the process clean.
DISCO DFG8560 Technical Specifications
| Parameter | Description |
|---|---|
| Equipment Type | Fully automatic wafer grinder |
| Manufacturer | DISCO Corporation |
| Model | DFG8560 |
| Wafer Size | 300mm |
| Grinding Method | In-feed grinding with wafer rotation |
| Grinding Wheel | Φ300mm diamond wheel |
| Spindle Output | 4.8kW |
| Spindle Speed | 1,000 - 4,000 rpm |
| Grinding Capability | Ultra-thin wafer grinding below 100μm |
| Process Integration | DBG and polishing inline system |
Specifications are based on DISCO published product information.
