The DISCO DFG8560 stands as a high-performance automatic backgrinder, tailored to thin 200mm wafers ahead of dicing operations. Leveraging DISCO’s industry-leading grinding technology, this system tightly controls total thickness variation and suppresses edge chipping to protect delicate wafers.
Its twin-spindle configuration streamlines coarse and fine grinding in one continuous cycle. Closed-loop thickness monitoring dynamically tunes grinding parameters, removing material evenly and lowering the chance of wafer cracking. An integrated clean-and-dry module keeps wafers contamination-free once thinning completes.
DISCO DFG8560 Technical Specifications
| Parameter | Description |
|---|---|
| Equipment Type | Fully automatic wafer grinder |
| Manufacturer | DISCO Corporation |
| Model | DFG8560 |
| Wafer Size | 300mm |
| Grinding Method | In-feed grinding with wafer rotation |
| Grinding Wheel | Φ300mm diamond wheel |
| Spindle Output | 4.8kW |
| Spindle Speed | 1,000 - 4,000 rpm |
| Grinding Capability | Ultra-thin wafer grinding below 100μm |
| Process Integration | DBG and polishing inline system |
Specifications are based on DISCO published product information.
