The DISCO DFG8830 wafer grinder is a fully automatic semiconductor grinding system engineered to tackle hard, brittle substrates including silicon carbide (SiC), sapphire and compound semiconductor materials. Its rigid spindle architecture delivers robust grinding force, reliably handling tough substrates over long production runs.
Using precision rotational in-feed grinding technology, this grinder keeps TTV under tight control while limiting edge chipping and subsurface defects. It lowers residual stress after thinning, protecting delicate wafers. Flexible recipe controls enable quick transitions between different wafer types and process setups.
DISCO DFG8830 Technical Specifications
| Parameter | Description |
|---|---|
| Equipment Type | Fully automatic wafer grinder |
| Manufacturer | DISCO Corporation |
| Model | DFG8830 |
| Supported Wafer Size | Φ4 / 5 / 6 inch |
| Supported Substrate Size | Φ5 / 6 / 8 inch |
| Spindle Configuration | 4 axes |
| Chuck Tables | 5 chuck tables + turntable |
| Grinding Wheel | Φ300mm diamond wheel |
| Spindle Output | 6.3 kW |
| Rotation Speed | 1000 - 4000 rpm |
| Main Materials | SiC, sapphire, hard brittle materials |
Specifications are based on DISCO published product information.
