The DISCO DFG8830 automatic wafer grinder processes hard, brittle substrates such as SiC, sapphire and compound semiconductors. Its rigid spindle delivers steady grinding force and maintains stable operation over long production runs.
Rotary feed grinding keeps wafer TTV in check. It cuts edge chipping and subsurface damage while lowering residual stress after thinning to protect fragile wafers. Recipe changes switch between different wafer types and process settings quickly.
DISCO DFG8830 Technical Specifications
| Parameter | Description |
|---|---|
| Equipment Type | Fully automatic wafer grinder |
| Manufacturer | DISCO Corporation |
| Model | DFG8830 |
| Supported Wafer Size | Φ4 / 5 / 6 inch |
| Supported Substrate Size | Φ5 / 6 / 8 inch |
| Spindle Configuration | 4 axes |
| Chuck Tables | 5 chuck tables + turntable |
| Grinding Wheel | Φ300mm diamond wheel |
| Spindle Output | 6.3 kW |
| Rotation Speed | 1000 - 4000 rpm |
| Main Materials | SiC, sapphire, hard brittle materials |
Specifications are based on DISCO published product information.
