The DISCO DGP8761 Ultra-thin Wafer Grinder is compatible with both 200mm and 300mm wafers. It integrates back-grinding and dry-polishing stress-relief capabilities onto a single platform. Its high-speed spindle enables wafer thinning to below 25 micrometers.
The system performs sequential coarse grinding, fine grinding, and dry polishing to eliminate subsurface damage and reduce residual stress. It effectively suppresses micro-cracks and wafer warpage while maintaining excellent Total Thickness Variation (TTV) control for ultra-thin substrates. An optimized wafer transfer process enhances productivity and ensures batch-to-batch consistency.
DISCO DGP8761 Technical Specifications
| Parameter | Description |
|---|---|
| Equipment Type | Fully automatic grinder/polisher |
| Manufacturer | DISCO Corporation |
| Model | DGP8761 |
| Wafer Size | Φ200mm / Φ300mm |
| Chuck Tables | 4 chuck tables |
| Axis Configuration | 3 axes |
| Main Process | Back grinding + stress relief |
| Grinding Wheel | Φ300mm diamond wheel |
| Polishing Pad | Φ450mm dry polishing / CMP option |
| Thin Wafer Capability | Below 25μm processing |
Specifications are based on DISCO published product information.
