The DISCO DGP8761 is an all-in-one automatic grinder-polisher designed for ultra-thin wafer thinning, compatible with 200 mm and 300 mm wafers. It merges backside grinding and dry polishing stress relief on a single platform. Its high-speed spindle enables wafer thinning down below 25 μm.
The system performs rough grinding, fine grinding and dry polishing sequentially to eliminate subsurface damage and reduce residual stress. It effectively suppresses microcracks and wafer warpage while maintaining excellent TTV control for ultra-thin substrates. Optimized wafer transfer improves throughput and guarantees stable batch-to-batch consistency.
It is widely adopted for advanced packaging applications, including power semiconductors, RF devices, MEMS sensors and memory chip manufacturing. The integrated process design streamlines wafer preparation and meets stringent quality requirements for high-performance semiconductor devices.
DISCO DGP8761 Technical Specifications
| Parameter | Description |
|---|---|
| Equipment Type | Fully automatic grinder/polisher |
| Manufacturer | DISCO Corporation |
| Model | DGP8761 |
| Wafer Size | Φ200mm / Φ300mm |
| Chuck Tables | 4 chuck tables |
| Axis Configuration | 3 axes |
| Main Process | Back grinding + stress relief |
| Grinding Wheel | Φ300mm diamond wheel |
| Polishing Pad | Φ450mm dry polishing / CMP option |
| Thin Wafer Capability | Below 25μm processing |
Specifications are based on DISCO published product information.
