The Nitto DR8500III automatic wafer mounter is a seamless tape lamination workhorse built to prepare wafers for backgrinding. As part of Nitto’s trusted NEL SYSTEM™ series, it delicately applies protective tape onto 200 mm wafers with steady tension control.
Its fully automated workflow handles wafer loading, tape mounting and edge trimming in sequence. The refined lamination mechanism lays tape smoothly without wrinkles or uneven stress, shielding fragile wafers from damage in subsequent thinning steps. Built-in process monitoring keeps results consistent batch after batch.
This pre-owned DR8500III has completed thorough inspection and calibration. Original Nitto spare parts are easily accessible for simple maintenance. Requiring only minimal setup before launch, it brings reliable, repeatable tape mounting to fabs looking for a budget-friendly solution for 200 mm wafer thinning and backend packaging.
Nitto DR8500III Technical Specifications
| Parameter | Description |
|---|---|
| Equipment Type | Automatic wafer protection tape applicator |
| Manufacturer | Nitto Denko |
| Series | NEL SYSTEM™ |
| Applicable Wafer Size | 200mm (8-inch wafer) |
| Main Process | Back grinding protection tape application |
| Operation Mode | Fully automatic |
| Application Material | Semiconductor protection tape |
| Industry Application | Semiconductor wafer processing |
Actual performance depends on wafer thickness, tape material, process parameters, and production requirements.
