The K&S 8028PPS delivers reliable ball bonding performance with 45μm fine pitch capability. Its high-resolution vision system locates bond pads accurately, maintaining stable wire loop geometry across long production runs. It accepts gold, copper and silver bonding wire within 20μm to 50μm diameter range, offering flexible options for different package designs.
Consistent bond pull and shear strength cut down reject rates in IC and LED packaging. The machine’s intuitive programming interface shortens recipe setup time, while robust mechanical construction keeps uptime high for continuous mass assembly.
K&S 8028PPS Technical Information
| Parameter | Description |
|---|---|
| Model | K&S 8028PPS |
| Equipment Type | Automatic ball wire bonding machine |
| Manufacturer | Kulicke & Soffa Industries |
| Main Application | Semiconductor backend assembly and IC packaging |
| Bonding Method | Thermosonic ball bonding |
| Typical Wire Material | Gold wire, subject to machine and process configuration |
| Operation Mode | Automatic production operation |
| Alignment Method | Vision-based product and bonding-point alignment |
| Process Control | Programmable bonding force, ultrasonic energy, bonding time, temperature, positioning, and loop profile |
| Product Compatibility | Depends on package design, bonding layout, wire specification, capillary, tooling, and machine configuration |
| Equipment Availability | Primarily available through the used and refurbished semiconductor equipment market |
Exact specifications and production capabilities may vary according to the installed hardware, software version, optional modules, material-handling system, tooling, and current machine condition. The nameplate, configuration list, and operating status should be verified before purchase.