Wire bonding quality directly determines the reliability of finished IC chips. The K&S ICONN Wire Bonder delivers high-speed and ultra-precise wire interconnection for semiconductor packaging.
High-resolution vision alignment and advanced bonding control maintain stable bond force and ultrasonic parameters throughout every cycle. Consistent ball and wedge bonding results keep deviation minimal for mass production. It supports gold, copper and silver wires, covering multiple packaging types.
Sustained long-run operation keeps output steady, cutting bonding-related defects and lowering overall production costs.
We have this wire bonder available for your production evaluation. Reach out to get full machine information and quotation.
K&S ICONN Wire Bonder Technical Specifications
| Parameter | Description |
|---|---|
| Equipment Type | Automatic ball wire bonding system |
| Manufacturer | Kulicke & Soffa (K&S) |
| Bonding Technology | Thermosonic ball bonding |
| Wire Material | Gold wire, copper wire and compatible bonding materials |
| Application | IC packaging, memory, LED and semiconductor devices |
| Operation Mode | Fully automatic production operation |
| Alignment System | Vision-based automatic alignment |
| Process Control | Automatic bonding parameter monitoring |
Actual performance depends on package structure, wire diameter, bonding process parameters, tooling condition, and manufacturing requirements.