The K&S MAXUM PLUS is a fully automatic thermosonic ball wire bonder developed by Kulicke & Soffa for semiconductor package assembly. It is mainly used to connect die pads to leadframes or substrates with fine bonding wire.
The platform was introduced as a faster and more accurate successor to the K&S MAXUM. Documented configurations provide fine-pitch bonding, programmable loop control and automatic material handling for volume production.
MAXUM PLUS machines can differ in bond head, wire kit, EFO system, material handler, workholder, software and included accessories. These items must be checked on the individual machine.
K&S MAXUM PLUS Specifications
| Manufacturer | Kulicke & Soffa |
|---|---|
| Brand | K&S |
| Model | MAXUM PLUS |
| Equipment Type | Fully automatic ball wire bonder |
| Bonding Process | Thermosonic ball bonding |
| Primary Wire Material | Gold wire |
| Copper Wire | Requires a compatible copper bonding configuration |
| Wire Diameter | 0.6 to 2.0 mils in documented configurations |
| Fine-Pitch Capability | Down to 35 μm in documented configurations |
| Bond Placement Accuracy | ±2.5 μm @ 3σ in documented configurations |
| Standard Loop Cycle | Approximately 63 ms under published reference conditions |
| Ball Formation | Electronic flame-off system |
| Operating Mode | Automatic production |
Values shown above are documented platform specifications. Actual capability depends on machine configuration, software, tooling, wire material, package design and equipment condition.
Applications
The MAXUM PLUS is used for fine-wire ball bonding after the die-attach process. Typical applications include:
Integrated circuit package assembly
Leadframe-based semiconductor packages
Discrete semiconductor devices
Small-signal and low-lead-count packages
Compatible LED and optoelectronic packages
Other gold-wire ball bonding applications
Suitability depends on the package dimensions, pad pitch, wire material, wire diameter, loop profile and material-handling format.
View other available wire bonder machines.
Machine Configuration
Used MAXUM PLUS machines should be checked for the following equipment and accessories:
Bond head and transducer configuration
EFO assembly and ball-formation hardware
Gold-wire or optional copper-wire kit
Material-handling system and magazine setup
Workholder, heater plate and package tooling
Vision camera, lighting and pattern-recognition system
Computer, operating system and machine software
Capillaries, wire guides and included spare parts
Power, compressed-air and gas requirements
Copper bonding capability must be confirmed from the installed hardware. It should not be assumed from the MAXUM PLUS model name alone.
Availability and Quotation
Contact us for current MAXUM PLUS availability, machine condition, location, included accessories and quotation.
Please include the following information with your inquiry:
Required quantity
Package or leadframe type
Wire material and diameter
Pad pitch and loop requirements
Required material-handling format
Preferred machine condition
Delivery country