K&S MAXUM PLUS Automatic Ball Wire Bonder

The K&S MAXUM PLUS wire bonder achieves a minimum cycle time of 63ms under standard wire length and loop height conditions. It handles ultra-fine gold wires as thin as 15μm, produces bonded balls with a minimum size of 35μm, and maintains a stable bonding accuracy of ±2.5μm (at 3σ). With adjustable ultrasonic output stages, energy distribution for ball bonding and second-bond wedge bonding can be independently optimized for various pad materials, thereby reducing the risk of damage to thin dielectric layers.

The vision system continuously captures substrate images, ensuring reliable recognition even on low-contrast surfaces. An integrated automatic capillary cleaning function minimizes bonding defects caused by residue buildup on the capillary. The system supports the assembly of LEDs, discrete components, and RF chipsets. Hardware configurations vary by unit—with factors such as the bond head, EFO module, workholder, and software version influencing wire compatibility—so hardware specifications must be verified item-by-item prior to installation.