The KAIJO FB900 is a high-precision wire bonder, specially optimized for LED gold wire bonding applications. It delivers stable interconnection packaging for LED chips, ideal for mass production of LED discrete components and optoelectronic devices.
Equipped with advanced ultrasonic bonding control and high-speed motion system, the machine achieves consistent bond strength and superb bond repeatability. It supports fine gold wires with tiny diameters, meeting the requirements of miniaturized LED chip packaging without damaging delicate epitaxial layers.
Compact machine footprint and intuitive operation interface simplify recipe switching for different LED products. With reliable long-run stability and low maintenance demand, it remains a mainstream packaging tool for LED manufacturing lines.
KAIJO FB900 Technical Information
| Parameter | Description |
|---|---|
| Model | KAIJO FB900 |
| Equipment Type | Fully automatic wire bonding machine |
| Manufacturer | KAIJO Corporation |
| Main Application | LED packaging and related microelectronic assembly |
| Bonding Method | Thermosonic wire bonding |
| Typical Wire Material | Gold wire, subject to process configuration |
| Operation Mode | Automatic production operation |
| Alignment | Automatic vision-based product and bonding-point alignment |
| Process Control | Programmable bonding force, ultrasonic energy, bonding time, temperature, and loop profile |
| Product Compatibility | Depends on package dimensions, lead-frame design, bonding layout, tooling, and machine configuration |
Exact specifications may vary according to the machine version, installed options, software configuration, tooling, and previous production setup. The equipment nameplate, configuration list, and current machine condition should be checked before purchase.