The KAIJO FB900 high-precision wire bonder provides stable interconnect packaging for LED chips, making it an ideal choice for the mass production of discrete LED components and optoelectronic devices.
Equipped with an advanced ultrasonic bonding control system and a high-speed motion system, the equipment delivers consistent bonding strength and exceptional repeatability. It supports ultra-fine gold wire, meeting the requirements for miniaturized LED chip packaging without damaging delicate epitaxial layers.
Its compact footprint and intuitive user interface simplify recipe switching between different LED products. With its reliable long-term operational stability and low maintenance requirements, it remains a mainstream packaging tool for LED production lines.
KAIJO FB900 Technical Information
| Parameter | Description |
|---|---|
| Model | KAIJO FB900 |
| Equipment Type | Fully automatic wire bonding machine |
| Manufacturer | KAIJO Corporation |
| Main Application | LED packaging and related microelectronic assembly |
| Bonding Method | Thermosonic wire bonding |
| Typical Wire Material | Gold wire, subject to process configuration |
| Operation Mode | Automatic production operation |
| Alignment | Automatic vision-based product and bonding-point alignment |
| Process Control | Programmable bonding force, ultrasonic energy, bonding time, temperature, and loop profile |
| Product Compatibility | Depends on package dimensions, lead-frame design, bonding layout, tooling, and machine configuration |
Exact specifications may vary according to the machine version, installed options, software configuration, tooling, and previous production setup. The equipment nameplate, configuration list, and current machine condition should be checked before purchase.