The Besi Datacon 2200 APM is an automatic multi-chip die bonder used for semiconductor die attach and configured flip chip assembly.
The machine can pick components from wafer-based supply and place them onto substrates or carriers. Depending on its original configuration, the system may also include dispensing, wafer changing, automatic tool changing, fluxing and different substrate-handling modules.
The 2200 APM was supplied in different configurations. The model name alone does not confirm the installed process modules or the machine’s current operating condition. These details should be checked against the machine nameplate, configuration list and inspection results.
Machine Specifications
| Manufacturer | Besi / Datacon |
|---|---|
| Model | Datacon 2200 APM |
| Equipment Type | Automatic multi-chip die bonder |
| Primary Process | Die attach |
| Flip Chip Capability | Available on machines fitted with the required flip chip hardware and tooling |
| Wafer Handling | Up to 12-inch wafer handling on documented configurations |
| Dispensing | Integrated dispenser available on selected configurations |
| Tool Handling | Automatic tool changer available on selected configurations |
| Vision System | Configuration may include substrate vision and up-looking camera |
| Material Handling | Wafer changer, magazine handler, conveyor or buffer, depending on the machine |
| Condition | Used equipment; condition and availability must be confirmed |
Exact placement accuracy, throughput, wafer size and installed functions should be confirmed from the documentation and test results of the individual machine. Specifications from the 2200 APM+ or 2200 EVO should not be applied to the 2200 APM.
Typical Applications
Semiconductor die attach
Multi-chip assembly
Epoxy or adhesive die bonding
Flip chip assembly on suitably configured machines
Assembly processes requiring dispensing and vision alignment
Whether a used machine is suitable for a specific product depends on its bond head, wafer-handling system, vision hardware, dispensing or fluxing modules, software version and installed tooling.
Configuration to Confirm
Before purchasing a used Datacon 2200 APM, confirm the installed equipment rather than relying only on the model number.
Complete model designation and serial number
Bond head and pick-and-place head configuration
Supported wafer size and wafer-table type
Wafer handler or automatic wafer changer
Dispenser type and number of dispensing units
Fluxer or other flip chip process hardware
Substrate camera and up-looking vision system
Magazine, conveyor or buffer configuration
Automatic tool changer
Operating software, controller and industrial PC
Included tooling, manuals and spare parts
Condition and Inspection
For a used machine, the inspection should cover the parts that directly affect operation and repeatability.
Machine power-up and software startup
Movement of the main axes and wafer table
Bond head and pick-and-place operation
Camera image and vision alignment
Wafer loading and unloading functions
Dispenser or fluxer operation, if installed
Tool-change function, if installed
Error history and current alarm status
Availability of tooling, manuals and backup files
If possible, request a recent power-on video, configuration photographs and a test report for the actual machine being offered.
Availability and Quotation
Availability depends on the current machine configuration and location. To check a Besi Datacon 2200 APM, send the required process, die size, wafer size, substrate type and destination.
If you already have a machine serial number or configuration list, include it with the enquiry so that the installed modules and tooling can be checked.
View more available die bonders for semiconductor assembly.
