For post-mold singulation and lead shaping, the Besi Fico Compact Line-P Trim and Form System rethinks backend packaging with a compact inline layout. Instead of separate standalone stations, it merges trim and lead forming workflows to cut material transfer risks between processes.
This equipment excels at thick leadframes typical of power semiconductors. Its robust mechanical structure maintains tight dimensional tolerances over long production runs, while integrated tracking captures batch data to satisfy automotive quality traceability requirements.
Besi Fico Compact Line-P Machine Information
| Manufacturer | Besi / Fico |
|---|---|
| Model | Fico Compact Line-P (FCL-P) |
| Equipment Type | Modular semiconductor trim and form system |
| Application | Trim, form and related handling of leadframe-based power semiconductor packages |
| Press Force | 50 kN according to the manufacturer’s model specification |
| Maximum Speed | Up to 250 strokes per minute; practical output depends on the product, tool and line configuration |
| Leadframe Length | 150–300 mm |
| Leadframe Width | 18–125 mm |
| Leadframe Thickness | 0.1–2 mm |
| Package Thickness | Up to 10 mm according to the model specification |
| Condition | Pre-owned semiconductor packaging equipment |
| Actual Configuration | Confirmed according to the specific machine available |
| Delivery Scope | Based on the quotation and confirmed equipment list |
| Shipping | Export packing and worldwide delivery |
