The Besi Datacon 2200 EVO is a high-accuracy multi-chip die bonder for die attach, flip chip and mixed assembly processes.
The modular platform supports up to four working heads and can combine component placement, dispensing, flux dipping and bonding within one machine. Components can be picked from wafers, waffle packs, Gel-Pak trays or feeders and placed onto substrates, carriers, PCBs, leadframes or wafers.
Each 2200 EVO may have a different combination of bond heads, dispensing systems, wafer handling, substrate handling, heating and application tooling. The installed configuration should therefore be checked before confirming whether a particular machine is suitable for the required process.
Datacon 2200 EVO Specifications
| Manufacturer | Besi / Datacon |
|---|---|
| Model | Datacon 2200 EVO |
| Equipment Type | Multi-chip die bonder |
| Placement Accuracy | ±10 µm at 3 sigma; 7 µm available on request |
| Theta Accuracy | ±0.15° at 3 sigma |
| Bond Force | 0.5 to 75 N, programmable |
| Die Attach Throughput | Up to 7,000 units per hour per module |
| Flip Chip Throughput | Up to 2,500 units per hour with dipping |
| Flip Chip Without Dipping | Up to 3,200 units per hour |
| Number of Working Heads | Up to four |
| Die Size for Die Attach | 0.17 to 50 mm |
| Die Size for Flip Chip | 0.5 to 50 mm |
| Die Thickness | Above 50 µm; thinner dies on request |
| Wafer Size | 4 to 12 inches |
| Substrate Working Range | Up to 325 × 200 mm |
| Bond Head Rotation | 0° to 360° |
| Heated Bond Head | Up to 450°C, optional |
| UV Curing | 365 nm and 405 nm |
| Machine Dimensions | 1,160 × 1,225 × 1,750 mm |
| Machine Weight | Approximately 1,300 kg |
The figures above are published specifications for the standard Datacon 2200 EVO. Actual output and process capability depend on the installed heads, material handling, process modules, tooling and product.
Supported Processes and Applications
The 2200 EVO can be configured for cold and heated assembly processes using epoxy, soldering or thermo-compression bonding.
Semiconductor die attach
Flip chip assembly
Multi-chip module assembly
System-in-package assembly
Hybrid and mixed-technology products
Epoxy writing and stamping
Flux dipping
Assembly onto PCBs, leadframes, carriers and wafers
Supported input formats include wafers, 2-inch and 4-inch waffle packs, Gel-Pak trays and feeders. JEDEC tray handling may also be available, depending on the machine configuration.
Machine Configuration
A used Datacon 2200 EVO should be evaluated from its actual configuration rather than the model name alone. Check the following equipment before requesting a quotation:
Number and type of working heads
Standard or heated bond heads
Die attach and flip chip hardware
Wafer size and installed wafer frames
Automatic wafer-changing system
Waffle pack, Gel-Pak, tray or feeder input
Dispenser type and number of dispensing units
Flux dipping and UV-curing equipment
Substrate and carrier handling
Automatic tool changer
Vision cameras and alignment hardware
Wafer mapping and substrate mapping software
Barcode or Data Matrix recognition
Product-specific tooling and fixtures
Two machines with the same model designation may require different levels of modification for the same product. Configuration photographs and the original option list are therefore important when comparing available equipment.
Condition and Inspection
For a used machine, inspection should confirm that the installed modules are complete and that the main operating functions can be tested.
Machine power-up and software startup
X, Y, Z and theta-axis movement
Bond head operation and force control
Wafer table and automatic wafer change
Camera image, lighting and vision alignment
Dispenser, fluxer and heating functions
Automatic tool-change operation
Substrate loading and unloading
Current alarms and error history
Availability of software backups and machine manuals
Included tooling, fixtures and spare parts
A power-on video, recent machine photographs and a test report should be requested when an on-site inspection is not available.
Availability and Quotation
Availability, condition and installed options vary between individual machines. To check a Besi Datacon 2200 EVO, send the required process, die size, wafer size, substrate format, bonding material, quantity and destination.
If available, include the machine serial number, configuration list or photographs. This allows the installed heads, handling modules, software and tooling to be checked before quotation.
View more available die bonders for semiconductor assembly.
