The Datacon 2200 EVO is Besi's die bonder for multi-chip module assembly, positioned in the advanced packaging space. It's not just a placer — in standard configuration it runs die attach, flip chip, and multi-chip processes on one machine. Die comes from wafer, waffle pack, or Gel-Pak and goes onto substrate, carrier, PCB, or leadframe. Hot and cold processes both run without a platform swap.
Accuracy comes in tiers. The standard machine holds ±10µm X/Y at 3 sigma and ±0.15° theta. The evo plus tightens that to ±7µm. The evo advanced pushes to ±3µm at 3 sigma with a newer gantry and vision system. Which tier you need depends on how much placement error your product tolerates — camera modules and power modules don't sit in the same bracket.
Throughput: die attach up to 7,000 UPH per module, flip chip with dipping 2,500 UPH, without dipping 3,200 UPH. Die sizes from 0.17mm to 50mm. Thickness down to 50µm, thinner on request.
The variant split is where the real decision lives. Standard evo is the general-purpose workhorse. Evo advanced chases precision. Evo plus sits between them on cost and accuracy.But if your process involves sintering or high-force bonding, the evo hF is the one — bond force up to 500N against the standard machine's 75N range. Different animal, not a trim level. These machines are also highly configurable, so a used unit's spec sheet reflects what the original buyer ordered, not what the platform can do. Check the actual tooling list against your process line by line before committing.
Key Specifications of the Besi Datacon 2200 EVO Multi-Chip Die Bonder
| Dimension | Standard evo | evo plus | evo advanced | evo hF |
|---|---|---|---|---|
| X/Y accuracy @3σ | ±10µm | ±7µm | ±3µm | ±10µm |
| Theta accuracy @3σ | ±0.15° | ±0.10° | ±0.07° | Not disclosed |
| Bond force range | 0.5–75N | Not disclosed | 0.5–25N closed-loop | ≤500N |
| Die size (die attach) | 0.17–50mm | 0.17–50mm | 0.17–30mm | Not disclosed |
| Die thickness | >50µm | 50µm–7mm | 50µm–17mm | Not disclosed |
| Wafer size | 2″–12″ | 2″–12″ | 4″–12″ | 12″ SEMI |
| Substrate working range | 325×200mm | 325×200mm | 325×200mm | Not disclosed |
| Die attach UPH | ≤7,000/module | ≤7,000/module | ≤7,000/module | Not disclosed |
| Dimensions L×W×H | 1160×1225×1750mm | 1160×1225×1800mm | 1160×1225×1800mm | Not disclosed |
| Weight | ≈1,300kg | Not disclosed | ≈1,450kg/module | Not disclosed |
| Bond head heating | ≤450°C (optional) | ≤450°C (optional) | ≤450°C (optional) | ≤450°C |
Note: The evo hF is built for sintering and high-force bonding. Its 500N bond force ceiling is not in the same class as the standard machine's 75N — the distinction is process-driven, not a step up in precision tier. Bond force data for the evo plus is not separately disclosed in public materials and is left blank.
