The Besi Esec 2100 FC hS is a high-speed flip chip bonder for volume semiconductor packaging. It combines die flipping, flux dipping, alignment and placement in one automated platform. Typical applications include FCCSP, FCBGA, FC-SiP, FCOL, FC-MIS and CSP-LED.
Besi rates the machine at up to 16,000 units per hour. In High Accuracy Mode, the published bonding accuracy is 8 μm at 3σ. The platform accepts wafers from 4 to 12 inches and die sizes up to 20 mm.
Used Esec 2100 FC hS machines do not always have the same hardware. The substrate handler, slide fluxer, flip unit, vision system, die ejector and mapping functions must be checked on the individual machine. Contact us for current availability, machine photos and installed-option details.
Besi Esec 2100 FC hS Overview
The Esec 2100 FC hS is built for high-volume flip chip production. Its Phi-Y pick-and-place system combines rotary and linear movement to reduce placement time while maintaining stable positioning.
The machine can handle a wide range of wafer, die and strip formats. Depending on its configuration, it may also include automatic flux monitoring, pre-align vision, bond inspection, wafer mapping and different substrate-loading systems.
High-speed flip chip placement for volume production
Published throughput of up to 16,000 UPH
8 μm at 3σ accuracy in High Accuracy Mode
Minimum cycle time of 240 ms including dip fluxing
Support for 4- to 12-inch wafers
Die sizes from 0.2 mm with the Small Die Kit to 20 mm
Tool-less changeover of product-specific parts
Recipe transfer between compatible machines
Real-time monitoring of the process area and material flow
Esec 2100 FC hS Technical Specifications
| Manufacturer | Besi / Esec |
|---|---|
| Model | Esec 2100 FC hS |
| Equipment Type | High-speed flip chip bonder |
| Bonding Method | Flip chip |
| Published Throughput | Up to 16,000 UPH |
| Bonding Accuracy | 8 μm at 3σ in High Accuracy Mode |
| Minimum Cycle Time | 240 ms including dip fluxing |
| Wafer Size | 4 to 12 inches |
| Wafer Frame Size | 6, 8 and 12 inches |
| Die Size | 0.2 mm with the Small Die Kit to 20 mm |
| Die Thickness | From 0.05 mm / 2 mils; thinner die on request |
| Maximum Strip Length | 500 mm |
| Maximum Strip Width | 125 mm; flat boats up to 137 mm |
| Machine Dimensions | 1,430 × 1,440 × 1,400 mm (W × D × H) |
| Machine Weight | Approximately 1,400 kg / 3,000 lb |
| Equipment Condition | Used equipment, subject to availability |
The figures above describe the Esec 2100 FC hS platform. The capability of an individual used machine depends on its manufacturing year, software version, installed options, tooling and operating condition.
Typical Flip Chip Applications
The Esec 2100 FC hS is mainly used on production lines that require fast and repeatable flip chip placement. Besi lists the following package applications for this platform:
FCOL: Flip Chip on Leadframe
FC-MIS: Flip Chip Molded Interconnect Substrate
FC-SiP: Flip Chip System-in-Package
FCCSP: Flip Chip Chip-Scale Package
FCBGA: Flip Chip Ball Grid Array
CSP-LED: Chip-scale LED packaging
Package type alone is not enough to confirm compatibility. Die dimensions, wafer frame, substrate size, strip format and fluxing requirements also need to match the installed machine configuration.
For other face-down semiconductor assembly requirements, view our complete range of flip chip bonder equipment. Process-level information is also available in our advanced packaging and flip chip solutions.
Used Esec 2100 FC hS Price and Availability
Used Besi Esec 2100 FC hS machines are normally quoted individually. Price changes with the machine year, operating condition, installed options, included tooling, location and any inspection or refurbishment work required before shipment.
Contact us for the current equipment list. When a suitable machine is available, we can provide its basic information, photos, configuration details and a quotation for your destination.
To help us check the correct machine, please send:
Required model and quantity
Preferred machine year or condition
Die size and thickness
Wafer and frame size
Package and substrate format
Required fluxing or inspection options
Delivery country
Besi Esec 2100 FC hS FAQ
What is the throughput of the Esec 2100 FC hS?
Besi publishes throughput of up to 16,000 units per hour and a minimum cycle time of 240 ms including dip fluxing. Actual production speed changes with the package, die size, process settings and machine configuration.
What is the placement accuracy of the Esec 2100 FC hS?
The published bonding accuracy is 8 μm at 3σ in High Accuracy Mode. This mode may need to be confirmed on the individual used machine.
Is the Esec 2100 FC hS the same as the Esec 2100 hS?
No. The Esec 2100 FC hS is designed for flip chip bonding. The Esec 2100 hS is mainly an epoxy die attach platform, although both machines belong to the Esec 2100 family.
What should be checked before buying a used machine?
Check the substrate handler, fluxer, flip unit, die ejector, vision options, software, mapping functions, tooling and current operating condition. These items can differ between machines with the same model name.
How can I get the current price?
Send us the required configuration, quantity and delivery country. We will check current availability and provide a quotation for a suitable machine.
USED SEMICONDUCTOR EQUIPMENT
