The ThinkLaser HM300 automates permanent laser hard marking for full-size 300mm wafers. Its integrated optical and handling subsystem safely loads and positions wafers, avoiding scratches or thermal damage to sensitive substrate surfaces during the marking sequence.
Character quality and position are fully controllable. The system generates crisp, durable edge codes for traceability and meets SEMI industry specifications. Operators can easily adjust marking parameters to fit diverse wafer materials, supporting continuous operation within existing 300mm fabrication workflows.
