The ThinkLaser SigmaDSC performs automated wafer hard-marking with outstanding positioning accuracy for cleanroom operations. The finely tuned laser engraves identifiers on wafer edges, keeping mark placement deviation tightly controlled even during continuous production.
These etched marks are permanent. They remain legible after high-temperature annealing and repeated wet processing steps. Its precision chuck secures wafers steadily to prevent surface scratches when loading and marking. All codes and characters follow SEMI standards, generating clear, OCR-readable marks to track wafers across the full fabrication sequence. It fits well into existing production setups and holds steady marking accuracy through long manufacturing batches.
