The Besi AMS-X leadframe packaging system employs a reliable transfer molding process, utilizing epoxy resin to encapsulate the die and protect sensitive chip structures from moisture, physical stress, and environmental contaminants; the system is suitable for packaging power semiconductors and discrete devices.
Advanced molding control technology minimizes defects such as flash and voids. Its modular design simplifies mold changes and routine maintenance, ensuring stable production line output while meeting the demands for frequent product switching in high-mix manufacturing environments.
Besi AMS-X Leadframe Molding System Specifications
| Manufacturer | Besi |
|---|---|
| Model | AMS-X |
| Equipment Type | Automatic leadframe molding system |
| Primary Application | Molding of high-density and power semiconductor packages |
| Maximum Leadframe Size | 125 × 300 mm |
| Maximum Leadframe Thickness | 10 mm |
| Maximum Clamp Force | 1,800 kN |
| Maximum Mold Opening | 150 mm |
| Maximum Transfer Pressure | 15 MPa |
| Pellet Diameters | 14, 14.3, 16 or 18 mm |
| Machine Dimensions | Approximately 5,160 × 1,500 × 1,800 mm |
| Machine Weight | Approximately 9,500 kg |
| Condition | Pre-owned semiconductor packaging equipment |
| Actual Configuration | Confirmed according to the specific machine offered |
| Delivery Scope | Based on the quotation and confirmed equipment list |
| Shipping | Export packing and worldwide delivery |
