The Besi AMS-X Leadframe Molding System delivers reliable transfer molding optimized for leadframe-based semiconductor packages. It encapsulates dies with epoxy compound to protect sensitive chip structures from moisture, physical stress and environmental contaminants, covering power semiconductors and discrete components.
Advanced mold pressure regulation reduces flash and void defects. Its modular construction simplifies mold replacement and routine maintenance, helping packaging lines achieve stable throughput while supporting frequent product changeovers for high-mix production.
Besi AMS-X Leadframe Molding System Specifications
| Manufacturer | Besi |
|---|---|
| Model | AMS-X |
| Equipment Type | Automatic leadframe molding system |
| Primary Application | Molding of high-density and power semiconductor packages |
| Maximum Leadframe Size | 125 × 300 mm |
| Maximum Leadframe Thickness | 10 mm |
| Maximum Clamp Force | 1,800 kN |
| Maximum Mold Opening | 150 mm |
| Maximum Transfer Pressure | 15 MPa |
| Pellet Diameters | 14, 14.3, 16 or 18 mm |
| Machine Dimensions | Approximately 5,160 × 1,500 × 1,800 mm |
| Machine Weight | Approximately 9,500 kg |
| Condition | Pre-owned semiconductor packaging equipment |
| Actual Configuration | Confirmed according to the specific machine offered |
| Delivery Scope | Based on the quotation and confirmed equipment list |
| Shipping | Export packing and worldwide delivery |
