Versatility defines the Besi MMS-X Semiconductor Molding System. This unified molding platform supports both transfer molding and compression molding, removing the need for separate dedicated machines to handle varied encapsulation tasks in semiconductor packaging.
Precision control over resin flow and clamping force keeps defects like voids and flash to a minimum. Its modular design streamlines tooling swaps and daily maintenance, perfectly fitting packaging houses running a wide portfolio of IC, power and discrete chip products.
Besi MMS-X Machine Information
| Manufacturer | Besi |
|---|---|
| Model | MMS-X |
| Equipment Type | Semiconductor molding system |
| Application | Semiconductor package molding and related production handling |
| Condition | Pre-owned semiconductor packaging equipment |
| Product Compatibility | Determined by the installed mold, product format and actual machine configuration |
| Machine Configuration | Confirmed according to the specific unit available |
| Delivery Scope | Based on the quotation and confirmed equipment list |
| Support | Initial fault review, mold and parts matching, and repair discussion |
| Shipping | Export packing and worldwide delivery |
