The Besi Fico AMS-i handles high-speed semiconductor transfer molding, encapsulating dies with epoxy compound to shield sensitive chip structures from moisture and mechanical harm. The machine supports a wide range of package formats, covering discrete devices, power chips and compact ICs for mid-to-high volume packaging lines.
Precise material injection and mold clamping reduce flash and void defects during encapsulation. Modular hardware layout simplifies mold changeover. Operators can swap product recipes quickly, which fits production sites managing multiple package types and frequent lot switching.
Besi Fico AMS-i Machine Information
| Manufacturer | Besi Fico |
|---|---|
| Model | Fico AMS-i |
| Equipment Type | Fully automatic semiconductor molding system |
| Primary Application | Encapsulation of compatible leadframe-based semiconductor packages |
| Molding Compound | Pelletized molding compound |
| Leadframe Size | Up to 75 mm wide and 280 mm long according to the manufacturer’s model specification |
| Press Configuration | Two- or three-press system according to the model configuration |
| Press Clamp Force | 90 tons according to the manufacturer’s model specification |
| Cavity Temperature Difference | ±2°C according to the manufacturer’s model specification |
| Condition | Pre-owned semiconductor packaging equipment |
| Actual Configuration | Confirmed according to the specific machine available |
| Delivery Scope | Based on the quotation and confirmed equipment list |
| Shipping | Export packing and worldwide delivery |
