For medium-volume leadframe packaging lines, the Besi Fico AMS-LM Molding System provides dependable transfer molding capability. It encapsulates semiconductor dies with epoxy compound to create a robust protective layer against moisture, dust and mechanical stress.
The system balances stable cycle performance with accessible maintenance. Its streamlined tooling setup lowers operational complexity, well suited for packaging manufacturers handling diverse discrete devices and power ICs.
Besi Fico AMS-LM Machine Information
| Manufacturer | Besi / Fico |
|---|---|
| Model | AMS-LM |
| Equipment Type | Semiconductor molding system |
| Application | Semiconductor package encapsulation and related product handling |
| Condition | Pre-owned semiconductor packaging equipment |
| Product Compatibility | Determined by the installed mold, product format and actual machine configuration |
| Molding Configuration | Confirmed according to the specific machine offered |
| Delivery Scope | Based on the quotation and confirmed equipment list |
| Support | Initial fault review, mold and parts matching, and repair discussion |
| Shipping | Export packing and worldwide delivery |
