The Besi Fico FML Molding System is a production-grade encapsulation solution tailored for leadframe semiconductor packages. Its refined transfer molding process ensures even epoxy distribution across each unit, preserving chip integrity against humidity and physical impact during downstream assembly.
Engineered for space-conscious cleanrooms, the unit’s compact layout does not compromise process stability. Operators benefit from simplified mold change workflows, cutting idle time when shifting between different device families and supporting flexible batch manufacturing.
Besi Fico FML Machine Information
| Manufacturer | Besi / Fico |
|---|---|
| Model | FML |
| Equipment Type | Semiconductor molding system |
| Application | Semiconductor package encapsulation and related production handling |
| Condition | Pre-owned semiconductor packaging equipment |
| Product Compatibility | Determined by the installed mold, product format and machine configuration |
| Actual Configuration | Confirmed according to the specific machine available |
| Delivery Scope | Based on the quotation and confirmed equipment list |
| Support | Initial fault review, mold and parts matching, and repair discussion |
| Shipping | Export packing and worldwide delivery |
