32-Position Turret Platform for Semiconductor Test, Inspection, and Finishing
The Cohu Ismeca NY32 consolidates semiconductor test, inspection, and finishing into a single handling sequence. Electrical contacting, multi-surface vision inspection, and output packaging all occur within one continuous rotation—not as separate offline steps.
Throughput and Turret Operation
The 32-position turret indexes devices through a fixed sequence of process stations, including up to 16 electrical test sites and multiple vision positions. This eliminates the back-and-forth transfer motion typical of pick-and-place handlers.
Throughput reaches 30,000 units per hour for discrete and DFN packages, with LED devices achieving up to 35,000 UPH. Typical MTBA exceeds 2 hours and MTBF beyond 168 hours.
NVcore Inspection Capability
Inspection centers on the NVcore vision platform, which performs full six-sided inspection covering top, bottom, and all four sidewalls.
For advanced packaging, 3D Flex technology measures true ball and bump coplanarity—critical for BGA and WLCSP devices where solder joint integrity affects board-level reliability. Inspection runs inline during turret rotation, so throughput is unaffected.
Configurable Contacting Force
The platform handles a broad spectrum of device sensitivities through configurable Z-axis force profiles:
Standard independent Z-axis contacting: up to 7N per site
Optional high-force configuration: up to 27N
Pneumatic plunger option: up to 50N
This range allows fragile thin dies to be handled without damage while still achieving reliable contact on thick power packages.
Device Range and Output Options
Applicable device range spans 0.3 × 0.6 mm to 17 × 17 mm, covering discrete leaded packages, power discretes, DFN/QFN, SOIC, LED, BGA, MEMS, and bare die.
Output options include tape and reel, tube, tray, and bulk. An auto reel changer supports lights-out operation. In-tape inspection with automatic reject and replacement addresses a common quality gap in tape-and-reel finishing, where one defective unit can compromise an entire reel.
NY32 Selection Checklist
| Decision Dimension | Parameters to Verify | Your Actual Situation |
|---|---|---|
| Package compatibility | Overall range 0.3×0.6 to 17×17 mm; DFN/QFN thickness ≥0.30 mm; leaded discretes ≥0.38 mm; SOIC ≥0.90 mm | |
| Throughput | LED 35k / discrete DFN 30k / SOIC 25k / power discrete 20k / QFN + pneumatic ejector 17k UPH | |
| Contact force | Standard 7N; optional 27N high force / 50N pneumatic ejector | |
| Inspection depth | NVcore six-sided; Aquilae HR sidewall 5 µm; Aquilae Infrared internal cracks; 3D Flex ball/bump coplanarity | |
| Operational reliability | MTBA >2h; MTBF >168h; changeover <60min | |
| Training threshold | L1 operations 2 days; L2 maintenance 5 days + 30 days experience; L3 advanced 7 days + 6 months experience | |
| Core function positioning | U.S. customs ruling: primary function is optical inspection, sorting and packaging secondary |
