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Cohu Ismeca NY32 Test Handler

Pre-owned Cohu Ismeca NY32 test handler. Ask about machine condition, installed tooling, delivery scope, repair support and replacement parts.

Cohu Ismeca NY32 Test Handler EQUIPMENT IMAGE
Configuration Review Model and installed options
New / Used Supply Subject to project availability
Global Delivery Destination-based assessment
Technical RFQ Package and process matching

The Cohu Ismeca NY32 rotary test handler brings flexible test handling capability for backend semiconductor production. Built around a 32-position turret, it combines device pick-and-place, electrical test and bin sorting in one compact cell.

It handles a broad spectrum of packaged parts: power management ICs, sensors, RF devices, LEDs and discretes. Multiple I/O options are available, including tape-and-reel, tray and tube output, letting lines switch easily between different packaging formats. The system runs both ambient and hot temperature tests to match component reliability specs.

Its integrated vision checks for physical defects during handling, catching surface flaws before parts move to final packaging. Quick changeover between different package types cuts downtime, which is ideal for factories running high-mix product schedules. The proven turret design keeps maintenance straightforward, making the NY32 a workhorse handler for mid-to-high volume test operations.

Cohu Ismeca NY32 32-position turret semiconductor test and inspection handler

Cohu Ismeca NY32 Machine Information

ManufacturerCohu Ismeca
ModelNY32
Equipment Type32-position turret test, inspection and packaging handler
Primary ApplicationsElectrical testing, visual inspection, sorting and final packaging of compatible semiconductor devices
Model-Level ThroughputUp to 30,000 units per hour, depending on the device and installed process
Test ParallelismUp to 16 test sites according to the manufacturer’s platform information
Device RangeApproximately 0.3 × 0.6 mm to 17 × 17 mm across applicable package families
Inspection CapabilitySix-side optical and infrared inspection according to the installed vision configuration
Typical Package TypesDiscrete, power discrete, DFN/QFN, SOIC, LED, BGA, MEMS, WLCSP and compatible bare die
ConditionPre-owned semiconductor test and finishing equipment
Delivery ScopeBased on the quotation and confirmed equipment list
SupportInitial fault review, parts matching and repair discussion
ShippingExport packing and worldwide delivery