For developing ultra-thin conformal films, the SAMCO AD-230LP brings plasma ALD capability to pilot production and R&D settings. The tool supports oxide and nitride film growth, a key enabler for fabricating MEMS and advanced power semiconductor structures.
What sets this system apart is its fine-tuned gas and plasma pulsing. It achieves atomic-scale thickness control and exceptional step coverage, critical when coating complex high-aspect-ratio features.
Unlike large production cluster tools, this compact reactor minimizes footprint while retaining full ALD process tunability. Fast chamber cleaning and simple hardware maintenance cut idle time, letting teams reliably trial new thin-film recipes.
SAMCO AD-230LP Main Specifications
| Manufacturer | SAMCO |
|---|---|
| Model | AD-230LP |
| Equipment Type | Load-Lock Plasma-Enhanced Atomic Layer Deposition System |
| Deposition Technology | Plasma-enhanced atomic layer deposition |
| Plasma Method | Capacitively coupled plasma in the published platform design |
| Wafer Loading | Load-lock chamber |
| Published Film Materials | AlN, SiN, AlOx and SiO2 |
| Film Control | Atomic-layer-level thickness control through sequential surface reactions |
| Primary Applications | Insulating films, passivation films and conformal coating of three-dimensional structures |
| Condition | Used semiconductor equipment |
| Availability | Subject to current stock, inspection and configuration confirmation |
