The SAMCO PD-3800L is a compact PECVD system capable of depositing silicon nitride, silicon dioxide, and silicon oxynitride films—materials commonly used for surface passivation and protective layers in power semiconductors.
Stable RF power control and optimized gas-mixing technology ensure excellent film uniformity across the wafer. The chamber design minimizes particle generation, guaranteeing clean deposition results for small-batch and pilot-scale production.
The tool offers easy recipe setup, convenient maintenance, and an accessible chamber opening, providing exceptional process flexibility. It is ideally suited for R&D laboratories and small-scale wafer fabs looking to create reliable thin-film stacks.
SAMCO PD-3800L Main Specifications
| Manufacturer | SAMCO |
|---|---|
| Model | PD-3800L |
| Equipment Type | Load-Lock Batch PECVD System |
| Deposition Technology | Plasma-enhanced chemical vapor deposition |
| Maximum Processing Area | Approximately 360 mm diameter carrier-tray area |
| Published Wafer Loading | Up to 9 × 3-inch, 6 × 4-inch or 3 × 6-inch wafers, depending on the carrier tray |
| Published Film Materials | SiO2, SiN, SiON and amorphous silicon |
| Published Process Examples | SiH4-SiNx, SiH4-SiO2, liquid-precursor SiNx and TEOS-SiO2 |
| Wafer Loading | Load-lock chamber with tray-based batch processing |
| Control Interface | Touch-screen parameter control and recipe storage in the published platform |
| Condition | Used semiconductor equipment |
| Availability | Subject to current stock, carrier configuration and inspection confirmation |
