The Besi Fico Compact Line-X is a high-precision Trim and Form System designed for post-mold leadframe processing in semiconductor packaging. It supports extreme high density (EXHD) leadframes up to 125 × 300 mm, delivering outstanding accuracy and stable Cpk performance for pre-plated and interdigit leadframes.
Equipped with high-force press module and built-in cyclone dust extraction, the system removes dam bars and shapes component leads in one continuous operation. Integrated vision inspection verifies lead geometry, while modular loading/unloading options including magazine, tray and tube handlers accommodate diverse packaging workflows.
Its modular architecture allows flexible integration of laser marking, deflash and sorting functions. Short transport strokes minimize leadframe damage, and RFID tool recognition enables automatic tool identification, stroke counting and full lot traceability for automated packaging factories.
Besi Fico Compact Line-X Machine Information
| Manufacturer | Besi / Fico |
|---|---|
| Model | Fico Compact Line-X (FCL-X) |
| Equipment Type | Modular semiconductor trim and form system |
| Application | Processing of high-density semiconductor leadframes |
| Leadframe Length | 170–300 mm according to the manufacturer’s model specification |
| Leadframe Width | 18–125 mm according to the manufacturer’s model specification |
| Leadframe Thickness | 0.1–0.4 mm according to the manufacturer’s model specification |
| Package Thickness | Up to 5 mm according to the manufacturer’s model specification |
| Press Force | 50 kN |
| Maximum Speed | Up to 250 strokes per minute; practical output depends on the product, tool and line configuration |
| Machine Size | Width depends on configuration; model depth 950 mm and height 1,455 mm |
| Condition | Pre-owned semiconductor packaging equipment |
| Actual Configuration | Confirmed according to the specific machine available |
| Delivery Scope | Based on the quotation and confirmed equipment list |
| Shipping | Export packing and worldwide delivery |
