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Besi Fico Compact Line-X Trim and Form System

Handles extreme high density leadframes up to 125 × 300 mm. Each press lane has its own vacuum and cyclone dust filter — preplated leadframes stay clean. 50 kN press force, up to 250 strokes/min, changeover under 3 minutes.

Besi Fico Compact Line-X Trim and Form System EQUIPMENT IMAGE
Configuration Review Model and installed options
New / Used Supply Subject to project availability
Global Delivery Destination-based assessment
Technical RFQ Package and process matching

The Besi Fico Compact Line-X high-precision trim and form system supports ultra-high-density (EXHD) lead frames up to 125 × 300 mm in size, delivering exceptional precision and stable Cpk performance for both pre-plated and staggered lead frame configurations.

Equipped with a high-pressure clamping module and a built-in cyclone dust removal unit, the system performs dam-bar cutting and lead forming in a single continuous operation. An integrated vision inspection system verifies lead geometry, while modular loading and unloading options—including handling units for magazines, trays, and tubes—accommodate diverse packaging workflows.

Its modular architecture allows for the flexible integration of laser marking, deburring, and sorting functions. A short-stroke transfer design minimizes lead frame damage, while RFID mold identification enables the automatic mold recognition, stroke counting, and full-batch traceability required for automated packaging facilities.

Besi Fico Compact Line-X Machine Information

ManufacturerBesi / Fico
ModelFico Compact Line-X (FCL-X)
Equipment TypeModular semiconductor trim and form system
ApplicationProcessing of high-density semiconductor leadframes
Leadframe Length170–300 mm according to the manufacturer’s model specification
Leadframe Width18–125 mm according to the manufacturer’s model specification
Leadframe Thickness0.1–0.4 mm according to the manufacturer’s model specification
Package ThicknessUp to 5 mm according to the manufacturer’s model specification
Press Force50 kN
Maximum SpeedUp to 250 strokes per minute; practical output depends on the product, tool and line configuration
Machine SizeWidth depends on configuration; model depth 950 mm and height 1,455 mm
ConditionPre-owned semiconductor packaging equipment
Actual ConfigurationConfirmed according to the specific machine available
Delivery ScopeBased on the quotation and confirmed equipment list
ShippingExport packing and worldwide delivery

Besi Fico Compact Line-X trim and form system