The SINTAIKE STK-6020 is a semi-automatic wafer tape lamination system for wafer thinning and backend packaging. Built by SINTAIKE, it applies protective tape prior to back grinding and dicing. This desktop tool handles 6/8-inch wafers (300–750 μm thick), supporting Si and GaAs substrates with blue dicing tape and UV tape. It features PLC control, a 7-inch touchscreen and full ESD protection.
It uses precision roller lamination with straight and loop cutting modes. The heater cutter adjusts up to 120°C for wrinkle-free lamination and clean edge trimming. Pneumatic pin positioning maintains consistent tape tension and reduces edge warping to secure process yield.
This pre-owned unit has completed full inspection and calibration. Mature design ensures easy spare parts sourcing. Ready to run without major modification, it delivers cost-effective tape mounting for process trials and small-medium batch production.
SINTAIKE STK-6020 Technical Specifications
| Parameter | Description |
|---|---|
| Equipment Type | Semi-automatic wafer tape laminator |
| Manufacturer | SINTAIKE Semiconductor Equipment |
| Main Application | Wafer protection tape mounting before thinning and dicing |
| Applicable Wafer Size | 4 inch / 5 inch / 6 inch / 8 inch |
| Wafer Thickness | Approximately 300-750 μm |
| Compatible Film | Blue tape and UV tape |
| Lamination Method | Anti-static roller lamination |
| Control System | PLC-based control system |
| Operation Mode | Semi-automatic loading and unloading |
| Application Field | Semiconductor, MEMS, LED, power devices |
Actual performance depends on wafer material, tape specification, wafer thickness, and production requirements.
