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SINTAIKE STK-7080 Non-contact Wafer Laminator

Non-contact vacuum wafer mounter. Edge contact only, no rollers. Handles thin wafers and compound semis (GaAs, GaN). 4–8", 100–750 μm. ±0.5 mm placement, 60+ WPH.

SINTAIKE STK-7080 Non-contact Wafer Laminator EQUIPMENT IMAGE
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Technical RFQ Package and process matching

The STK-7080 is a semi-automatic vacuum wafer mounter for 4- to 8-inch wafers, including silicon, silicon carbide (SiC), gallium arsenide (GaAs), and gallium nitride (GaN) substrates. It handles wafer thicknesses from 100 to 750 μm and laminates protective film using vacuum rather than direct roller pressure. This reduces mechanical stress on thin wafers and brittle wide-bandgap materials, helping limit breakage during processing.

The system specifies placement accuracy of ±0.5 mm, throughput of at least 60 wafers per hour, and a yield rate of 99.9%. Under cleanroom conditions, vacuum lamination produces a bubble-free interface, provided the workpiece and film are free from particle contamination. ULVAC vacuum pumps, PLC control, and a 10-inch touchscreen handle process monitoring and parameter records.

Film feeding, cutting, and waste collection are automated. Safety equipment includes light curtains and emergency stops, while ion fans help control static buildup. The STK-7080 also specifies an MTBF exceeding 500 hours, an MTTR below one hour, and scheduled downtime under 3%.

The machine can enter production after installation without hardware modifications. Its established production design, straightforward part replacement, and low maintenance requirements make it a practical option for small- and medium-batch wafer processing, particularly where flexible scheduling and initial equipment costs are important considerations.

SINTAIKE STK-7080 Wafer Mounter | Non-Contact Vacuum Lamination System

SINTAIKE STK-7080 Technical Specifications

ParameterDescription
Equipment TypeNon-contact vacuum wafer mounter
ManufacturerSINTAIKE
TechnologyRoller-free vacuum lamination
Wafer Size4 inch - 8 inch wafer
Wafer MaterialSilicon, SiC, GaAs, GaN
Wafer Thickness100μm - 750μm
Film TypeBlue film / UV film
Position AccuracyApproximately ±0.5mm
Control SystemPLC control with touchscreen interface
Operation ModeSemi-automatic

Specifications may vary depending on equipment configuration and customer process requirements.