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SINTAIKE STK-7080 Wafer Mounter | Non-Contact Vacuum Lamination System

Explore SINTAIKE STK-7080 semiconductor wafer mounter with non-contact vacuum lamination technology. Designed for thin wafer, SiC, GaN, GaAs and advanced wafer processing applications.

SINTAIKE STK-7080 Wafer Mounter | Non-Contact Vacuum Lamination System EQUIPMENT IMAGE
Configuration Review Model and installed options
New / Used Supply Subject to project availability
Global Delivery Destination-based assessment
Technical RFQ Package and process matching

The STK-7080 is a semi-automatic wafer vacuum mounter developed for compound semiconductor, MEMS and thin wafer temporary bonding applications. It accommodates 4–8 inch wafers with thickness of 100–750 μm and supports Si, SiC, GaAs and GaN substrates.

It adopts non-contact vacuum mounting, avoiding mechanical stress caused by conventional roller lamination and significantly reducing breakage risk for thin wafers and high-cost wide-bandgap substrates. It delivers ±0.5 mm mounting accuracy, throughput ≥60 wafers/hour and ≥99.9% yield with bubble-free lamination (particle contamination excluded). Equipped with a ULVAC vacuum pump, PLC and 10-inch touchscreen for recipe storage. MTBF>500 h, MTTR<1 h and planned downtime ≤3% to secure high uptime. Standard configurations include light curtain, E-stop and deionizing fan for ESD control.

This pre-owned unit comes with auto film feeding, cutting and waste collection. It can start production without modification. Featuring mature design and high spare part commonality for easy maintenance, it is well suited for flexible small-to-medium batch production and helps reduce project CAPEX.

SINTAIKE STK-7080 Wafer Mounter | Non-Contact Vacuum Lamination System

SINTAIKE STK-7080 Technical Specifications

ParameterDescription
Equipment TypeNon-contact vacuum wafer mounter
ManufacturerSINTAIKE
TechnologyRoller-free vacuum lamination
Wafer Size4 inch - 8 inch wafer
Wafer MaterialSilicon, SiC, GaAs, GaN
Wafer Thickness100μm - 750μm
Film TypeBlue film / UV film
Position AccuracyApproximately ±0.5mm
Control SystemPLC control with touchscreen interface
Operation ModeSemi-automatic

Specifications may vary depending on equipment configuration and customer process requirements.