The TOWA CPM1080 WLP/PLP Compression Molding System specializes in compression molding for wafer-level and panel-level packaging processes. It forms uniform epoxy encapsulation over large substrates, meeting the demanding requirements of thin, compact semiconductor packages.
With accurate resin dispensing and pressure regulation, the system minimizes voids, warpage and surface defects. Its flexible tooling setup accommodates different wafer and panel sizes, making it ideal for advanced packaging factories developing or mass-producing WLP and PLP devices.
TOWA CPM1080 Machine Information
| Manufacturer | TOWA |
|---|---|
| Model | CPM1080 |
| Equipment Type | WLP and PLP compression molding system |
| Workpiece Type | Semiconductor wafer or panel |
| Panel Size Range | 150–320 mm according to the manufacturer’s model specification |
| Maximum Wafer Size | Up to Ø320 mm according to the manufacturer’s model specification |
| Molding Compound | Granular or liquid resin, depending on the installed configuration |
| Standard Machine Time | Approximately 88 seconds; actual cycle time depends on the product, mold and process |
| Press Modules | One or two modules according to the model configuration |
| Clamp Capacity | 98–784 kN according to the manufacturer’s model specification |
| Automation Level | Full-auto, semi-auto or manual version confirmed from the actual machine |
| Condition | Pre-owned semiconductor packaging equipment |
| Delivery Scope | Based on the quotation and confirmed equipment list |
| Shipping | Export packing and worldwide delivery |
