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TOWA CPM1080 WLP/PLP Compression Molding System

The TOWA CPM1080 WLP/PLP compression molding system supports both granular and liquid resins and is compatible with 300mm wafers and 320×320mm panels.

TOWA CPM1080 WLP/PLP Compression Molding System EQUIPMENT IMAGE
Configuration Review Model and installed options
New / Used Supply Subject to project availability
Global Delivery Destination-based assessment
Technical RFQ Package and process matching

The TOWA CPM1080 WLP/PLP compression molding system performs wafer-level (WLP) and panel-level (PLP) compression molding processes, supporting both granular and liquid resin technologies on a single platform. It accommodates wafers up to 300mm and panels up to 320×320mm, covering applications such as FOWLP, FIWLP, FOPLP, FIPLP, and 2.5D/3D chiplet packaging.

The built-in resin dispensing unit features continuous metering and automatic refilling capabilities, ensuring consistent resin usage during high-volume production. An integrated robotic handler manages heavy or severely warped substrates without compromising alignment accuracy. Additionally, the pre-cut release film mechanism minimizes film consumption, thereby reducing recurring material costs in mass manufacturing.

The modular press architecture allows operators to flexibly adjust production capacity—by adding or removing press modules—to meet the needs of small-batch prototyping, pilot lines, and full-scale mass production. The platform offers manual, semi-automatic, and fully automatic configurations, enabling flexible deployment within existing cleanroom workflows at packaging facilities.

We offer fully inspected and tested refurbished TOWA CPM1080 compression molding systems and provide extended after-sales support for WLP and PLP molding production lines.

Key Specifications of TOWA CPM1080

ItemTOWA CPM1080 Compression Molding System
Process TypeWLP / PLP compression molding, dual resin support
Substrate SizeWafer up to 300mm; Panel up to 320 × 320 mm
Supported PackagingFOWLP, FIWLP, FOPLP, FIPLP, 2.5D / 3D chiplet molding
Resin OptionsGranular resin & liquid resin
Film HandlingPre-cut release film mechanism
System ArchitectureModular press modules, configurable automation level
Available UnitRefurbished, fully inspected & tested
SupportExtended after-sales maintenance service

Our refurbished TOWA CPM1080 systems go through comprehensive mechanical, electrical and process performance checks before delivery. Every unit is calibrated to maintain stable molding consistency, helping packaging factories reduce capital investment while keeping production reliability. Our long-term service package includes routine maintenance, spare parts consultation and on-site troubleshooting for WLP and PLP compression molding operations.

TOWA CPM1080 WLP and PLP compression molding system