The TOWA CPM1180 leverages large-panel compression molding to encapsulate multiple dies in a single cycle, greatly boosting throughput for advanced panel-level packaging. This molding method uses low-viscosity epoxy to fill intricate structures, cutting void risks for ultra-thin and large-size packages.
The rigid machine frame maintains consistent pressure across the full panel area. It comes with optimized resin dispensing and degassing functions, and supports quick mold swapping to adapt to different panel sizes and product variants.
TOWA CPM1180 Machine Information
| Manufacturer | TOWA |
|---|---|
| Model | CPM1180 |
| Equipment Type | Large-panel compression molding system |
| Primary Application | Panel-level packaging and compatible wafer molding |
| Workpiece Type | Panel or wafer, depending on the machine configuration |
| Maximum Panel Size | Up to 660 × 620 mm for the applicable full-automatic model configuration |
| Maximum Wafer Size | Up to 450 mm for the applicable manual model configuration |
| Molding Compound | Granular resin |
| Standard Machine Time | Approximately 75 seconds for the applicable full-automatic model configuration |
| Clamp Capacity | 49–1,764 kN according to the manufacturer’s model specification |
| Maximum Clamp Speed | 70 mm/sec according to the manufacturer’s model specification |
| Condition | Pre-owned semiconductor packaging equipment |
| Actual Configuration | Confirmed according to the specific machine available |
| Delivery Scope | Based on the quotation and confirmed equipment list |
| Shipping | Export packing and worldwide delivery |
