The TOWA Y1E4120 transfer molding system executes a robust process for encapsulating semiconductor chips. The cured epoxy resin layer effectively protects delicate chip circuitry from moisture, particulate contamination, and mechanical damage, ensuring safety during subsequent assembly and application.
Precise control over clamping force and resin injection effectively minimizes voids and flash. Rapid mold-change capabilities reduce downtime, meeting the needs of packaging facilities that handle mixed-device production as well as continuous, high-volume manufacturing.
TOWA Y1E4120 Machine Information
| Manufacturer | TOWA |
|---|---|
| Model | Y1E4120 |
| Equipment Type | Modular semiconductor transfer molding system |
| Workpiece Type | Substrate and leadframe |
| Workpiece Length | 100–260 mm according to the manufacturer’s model specification |
| Workpiece Width | 15–78 mm according to the manufacturer’s model specification |
| Molding Compound Diameter | Ø13, 14, 16, 18 or 20 mm |
| Molding Compound Length | 11.7–35.0 mm |
| Clamp Capacity | 392–1,176 kN / 40–120 tf, depending on configuration |
| Press Configuration | One to four press modules according to the model configuration |
| Standard Machine Time | Approximately 20 seconds; actual cycle time depends on the product, mold and process |
| Condition | Pre-owned semiconductor packaging equipment |
| Actual Configuration | Confirmed according to the specific machine available |
| Delivery Scope | Based on the quotation and confirmed equipment list |
| Shipping | Export packing and worldwide delivery |
