The Canon Anelva FC7100 PVD System processes titanium, titanium nitride, aluminum, and other conductive layers, meeting the metallization requirements for the manufacture of discrete and power devices.
Equipped with multiple sputtering targets and a high-precision wafer stage, the system delivers excellent thin-film uniformity and step coverage. An integrated load-lock chamber maintains vacuum integrity, minimizes particle contamination during wafer transfer, and enhances process repeatability.
Simplified chamber maintenance and easy access to consumables help control operating costs. The system integrates seamlessly into 150mm/200mm wafer fab workflows, providing stable metal deposition that ensures consistent device yields.
Canon Anelva FC7100 Main Specifications
| Manufacturer | Canon Anelva |
|---|---|
| Model | FC7100 |
| Equipment Type | Cluster-Type PVD Sputtering System |
| Supported Wafer Size | 300 mm / 12-inch wafers |
| Primary Process | Physical vapor deposition and reactive sputtering |
| Primary Published Application | High-k metal-gate film formation |
| Maximum Installed Modules | Up to five modules in the published platform |
| Configurable Module Types | Sputtering, etching, oxidation and heating, depending on configuration |
| System Architecture | Cluster platform |
| Listed Service Year | 2011, according to the available equipment page |
| Condition | Used semiconductor equipment |
| Availability | Subject to current stock, module configuration and inspection confirmation |
