The ASMPT AB589 is a fully automatic aluminum wire wedge bonder belonging to ASMPT’s rotary bond head platform series. Featuring a high-speed processing capability of 6.5 wires per second, patented "PR On-the-Fly" alignment technology, and a large effective bonding area of 8×6 inches, it delivers stable and efficient aluminum wire interconnection solutions for high-volume electronic packaging applications such as toy chips, LCD modules, medical devices, and LED panels.
Core Technical Features of the AB589
High-Speed Wire Bonding Capability
The AB589's standard bonding speed is 6.5 wires per second, corresponding to a 155 ms cycle time for a 2 mm wire loop. This speed sits in the mid-to-high range among aluminum wedge bonders and meets the rigid throughput demands of COB production lines. The key enabler is ASMPT's rotary bond head design—compared to traditional fixed-angle wedge bond heads, the rotary head adjusts bonding direction through programming, reducing time lost to workpiece repositioning.
Micro-Pitch Bonding Accuracy
The AB589 is rated for micro-pitch bonding at 55 × 65 μm, with bond placement accuracy of ±10.2 μm (±0.4 mil). The machine is equipped with a 4.3× optical system, a 1.2 × 0.9 mm field of view, and programmable focus. This optical configuration is primarily used for pad alignment and recognition on small features, offering practical value in the fine-line scenarios common to COB packaging.
PR On The Fly Alignment
The machine features ASMPT's patented "PR On The Fly" function, which performs pattern recognition during motion without stopping for alignment. Official materials position it as a key technology for "shortening alignment time." For high-volume production with multiple bond points and programs, this function directly affects the overall takt time per board.
Effective Bonding Area and Material Handling
The AB589's standard effective bonding area is 203.2 × 152.4 mm (8″ × 6″), with an optional 14″ × 6″ version available for larger workpieces. This range allows the machine to process multi-up PCBs without prior dicing, simplifying material flow through the production line.
With the optional AB589-H automatic material handling system, the machine can process raw PCBs or carriers directly, supporting board sizes from 100 to 215 mm in length, 25 to 162 mm in width, and 0.8 to 7.5 mm in thickness. Automatic loading and unloading enables continuous integration of bonding, downstream testing, and packaging, reducing manual intervention time.
ASMPT AB589 Physical Specifications
| Parameter | Specification |
|---|---|
| Dimensions | 1,170 × 800 × 2,020 mm |
| Machine Weight | Approx. 550–650 kg |
| Power Requirement | 230 V / 50-60 Hz |
| Air Requirement | > 5 bar |
| Z-Axis Travel | 15 mm |
| θ-Axis Travel | ±190° |
Selection Verdict
The AB589's positioning is clear: a high-speed aluminum wire wedge bonder for COB volume production lines. Rotary bond head, on-the-fly alignment, and an 8×6 inch work area are its three core technical differentiators. If your production line's workpieces fall within this size range, primarily use aluminum wire wedge bonding, and demand stable throughput, the AB589 deserves a spot on your comparison list. If your process is mainly gold ball bonding or requires higher bond placement accuracy, other solutions should be evaluated.
