The ASMPT Cheetah II wedge bonder integrates high-speed wire bonding with micron-level positioning capabilities, meeting the rigorous demands of packaging production lines for bonding consistency and productivity.
Core Technology 1: Precision Positioning Driven by Linear Motors
The Cheetah II's positioning capability is built on a multi-axis piezo-driven linear motor architecture.
Independent X/Y/Z Axis Drive
The X, Y, and Z axes each use an independent linear drive scheme, maintaining repeatable positioning consistency during high-speed reciprocating motion. This architecture reduces the mechanical wear and backlash errors associated with conventional lead screw transmission.
The Dual Role of Vision Alignment
The integrated vision system serves two functions within the machine: identifying substrate and die fiducials before bonding, and inspecting bond points in real time afterward. Image acquisition offers sub-pixel resolution, capable of detecting slight die offsets and automatically correcting coordinates. Position recognition accuracy reaches the ±2.5 μm level — a foundation for maintaining reliable placement as bond pad sizes continue to shrink.
Core Technology 2: Platform Integration of Three Bonding Methods
Unlike equipment limited to a single bonding method, the Cheetah II integrates three bonding technology paths on one platform.
Thermosonic Gold Ball Bonding
Material connection is achieved through high-frequency energy pulses, suitable for larger, heavier components or bond points requiring higher mechanical strength.
Thermosonic Copper Wedge Bonding
Also based on high-frequency energy pulses, but using a wedge-shaped bonding head for copper wire connections, offering another option between cost and conductivity.
Ultrasonic Wire Bonding
Solid-state diffusion is achieved through high-frequency vibration, suitable for low-temperature connection of small components and reducing thermal stress on sensitive devices.
This multi-process compatibility means a single machine can switch between different products without changing the hardware platform, lowering the equipment investment for line changeovers.
Core Technology 3: Temperature Control and Environmental Management
Bond quality is extremely sensitive to temperature fluctuation.
Constant Temperature and Thermal Drift Suppression
The Cheetah II's environmental control system is optimized for constant-temperature conditions, focusing on suppressing the effect of thermal drift on positioning accuracy.
Wide-Range Adjustable Heating Stage
The heating stage temperature can be adjusted from 0 to 400°C in 0.2°C increments, with heat dissipation management that prevents heat from conducting into non-bonding areas. The temperature control module works in conjunction with the software, allowing operators to adjust temperature profile parameters based on substrate material (ceramic, plastic leadframe, glass carrier, etc.) and wire type.
Core Technology 4: Software and Process Control
Real-Time Parameter Monitoring
The built-in software supports real-time monitoring and adjustment of temperature, power, speed, and bonding force.
Statistical Process Control (SPC)
The integrated SPC system continuously collects data during production, detects trending deviations, and enables timely intervention — intercepting quality issues before they become batch defects.
Program Storage and Automatic Detection
The system can store up to 128 component programs, enabling fast switching between prototype runs and small-batch production. The automatic missing-wire detection function immediately judges connection validity after bonding, reducing manual intervention in subsequent inspection steps.
Adaptability in Actual Production
The Cheetah II covers a component size range from 0603 to 55 mm, compatible with plastic leadframes, ceramic substrates, glass carriers, and tape automated bonding, among other substrate formats. A 4-inch diameter wire supply range reduces wire change frequency, supporting continuous production.
In fields such as optical communication devices, automotive electronic sensors, and medical microelectronic components, this equipment typically handles the wire bonding process for high-density multi-chip packaging.
Summary Parameter Reference
| Item | Specification |
|---|---|
| Bonding accuracy | ±2 μm level |
| Vision recognition accuracy | ±2.5 μm |
| Temperature range | 0–400°C, adjustable in 0.2°C increments |
| Component size range | 0603–55 mm |
| Program storage | 128 sets |
| Bonding methods | Thermosonic gold ball / copper wedge / ultrasonic |
The table above lists the specifications most often examined when evaluating this machine. Bonding accuracy and vision recognition accuracy together determine placement reliability in fine-pitch packaging; the 0 to 400°C heating range covers the process window for common substrate materials such as ceramic, plastic leadframe, and glass carrier; and 128 program storage slots correspond to the changeover needs of high-mix, low-volume production lines.
Frequently Asked Questions (FAQ)
What type of wire bonding equipment is the Cheetah II?
It is an automatic wedge wire bonder, belonging to the IC assembly system category, used for the wire interconnection process in semiconductor back-end packaging.
What bonding methods does the Cheetah II support?
It supports thermosonic gold ball bonding, thermosonic copper wedge bonding, and ultrasonic wire bonding, switchable on the same platform.
What packaging scenarios is this equipment suited for?
It is suited for scenarios requiring high-density multi-chip wire bonding, such as optical communication devices, automotive electronic sensors, and medical microelectronic components, covering component sizes from 0603 to 55 mm.
What is the positioning accuracy of the Cheetah II?
Bonding accuracy is at the ±2 μm level, and vision recognition accuracy is ±2.5 μm.
To learn about wire bonding configuration options for this equipment in specific packaging types, please [contact us] for selection advice.
