The machine is built around a high-speed visual recognition system, capable of fast pattern matching across diverse leadframe and substrate designs. It supports gold, copper and palladium-coated copper wire processes. The integrated BQM bonding quality monitoring module performs real-time inspection during production, spotting bonding defects instantly.
Rapid recipe changeover cuts downtime between different product runs. It delivers consistent throughput for both mass production and mixed small batch orders, and can connect to factory automation systems for full production data logging.
We have this wire bonder ready for your production evaluation. Send your inquiry to get full machine data and quotation.
ASMPT Cheetah II Technical Overview
| Parameter | Description |
|---|---|
| Equipment Type | Automatic wire bonding machine |
| Application | Semiconductor backend assembly and IC packaging |
| Bonding Technology | Thermosonic wire bonding |
| Bonding Materials | Gold wire, copper wire and compatible bonding materials |
| Recognition System | High-speed image recognition and alignment |
| Production Mode | High-volume automated manufacturing |
Actual production performance depends on package design, bonding materials, process parameters, and manufacturing conditions.
