The ASMPT SIPLACE CA2 integrated production unit handles combined SMD placement and bare die assembly within a single machine. SiP module production no longer requires separate stations for SMT mounting and die attach, cutting material handling efforts and floor space consumption.
The SIPLACE CA2 picks individual dies directly from diced wafers, removing the pre-die mounting step onto carriers. A dedicated die storage area isolates wafer picking from high-speed placement, so main production continues during wafer lot changeovers. Integrated vision hardware delivers micron-level alignment accuracy for fine-pitch flip chips and delicate bare dies. The unit can be integrated into existing SMT lines without extensive factory modification.
Technical Specifications – ASMPT SIPLACE CA2 Chip Assembly and SMT Placement Machine
| Parameter | Specification |
|---|---|
| Machine Type | Hybrid SMT & die assembly placement system |
| Component Inputs | Tape & reel SMD, sawn wafer bare dies |
| Supported Processes | SMD placement, direct die attach, flip chip placement |
| Throughput | Up to 76,000 SMD components/h; up to 54,000 dies/h |
| Placement Accuracy | 10 µm @ 3σ |
| Wafer Handling | Multi-lot management, fast wafer exchange |
| Core Advantage | No die taping required, decoupled die buffering, full part traceability |
| Conveyor | Single-lane / dual-lane configurable |
| Typical Use Cases | SiP modules, flip chip assembly, automotive electronics, 5G/IoT modules, power semiconductor packaging |
