ASMPT SIPLACE CA4 is a hybrid high-speed die placement platform that bridges semiconductor die attach and conventional SMT assembly on one production line. It targets SiP, advanced module and automotive packaging applications, removing the traditional boundary between bare die assembly and surface mount processes.
Unlike separate die bonders and SMT placement machines, this platform handles both sawn bare dies directly from wafers and tape-reel SMD components within a single pass. It eliminates intermediate die taping and related material costs, cutting extra handling steps that introduce alignment errors and yield loss. The built-in buffer mechanism decouples wafer pick-up from component placement, sustaining continuous high-volume output without workflow interruptions.
The system delivers micron-level placement accuracy for flip-chip and face-up die assembly. Its flexible wafer management system supports fast wafer swapping, while compatible SIPLACE feeders extend versatility for mixed-component assemblies. Integrated high-resolution vision performs fiducial alignment and real-time position correction, stabilizing consistency during long production runs.
Designed for smart factory integration, the machine connects seamlessly with ASMPT WORKS software for production monitoring, recipe management and traceability. Users can scale from process validation and pilot runs to full mass manufacturing. It is widely deployed for 5G modules, IoT sensors, automotive electronics and HPC SiP packages, saving factory floor space and lowering overall operational expenditure for mixed advanced packaging lines.
ASMPT SIPLACE CA4 Chip Assembly and Die Placement Machine Specifications
| Specifications | Details |
|---|---|
| Machine Type | Hybrid Bare Die & SMD Placement Platform |
| Primary Application | SiP, advanced module, automotive and high-density packaging |
| Placement Mode | Face-up die, flip chip, standard SMD components; mixed-run capability |
| Component Sources | Sawn wafers, tape-and-reel SMD feeders |
| Substrate Carriers | PCBs, ceramic substrates, panel carriers, custom module substrates |
| Core Mechanism | Decoupled wafer buffer system for continuous pick & place |
| Placement Accuracy | Micron-level precision with high-resolution vision alignment |
| Wafer Handling | Fast wafer exchange, support for multiple wafer lots |
| Software & Connectivity | ASMPT WORKS compatible, full process traceability |
| Production Profile | Pilot prototyping, mid-to-high volume mass production |
| Target Packages | 5G modules, automotive electronics, IoT sensors, HPC SiP |
| Platform Design | Unified hybrid assembly platform, compatible with SIPLACE feeder ecosystem |
Notes: The listed items outline base specifications for the ASMPT SIPLACE CA4 Chip Assembly and Die Placement Machine. Actual throughput, accuracy and process capability vary by component type, substrate material, product recipe and factory ambient environment. Throughput and yield should be validated with real production samples. Custom process setup and integration consultation are available on request.
