ASM LS100-2 High-Precision Laser Scribing Machine

The ASM LS100-2 High-Precision Laser Scribing Machine delivers sub-micron cutting precision and high throughput, making it an ideal choice for large-scale production lines that require a balance between yield and output. The system incorporates multiple patented technologies to ensure cutting stability and reliability.

Key Features:

• Sub-Micron Cutting Precision: Achieves cutting depth accuracy of σ≤1μm and XY cutting position accuracy of σ≤0.7μm with a cutting path width of ≤14μm — ensuring extremely high precision for Mini/Micro LED chip singulation.

• High-Speed Production: Capable of cutting approximately 10 million chips per hour, significantly improving production efficiency for high-volume Mini/Micro LED manufacturing lines.

• Patented Cutting Technology: Incorporates multiple patented technologies to further improve cutting stability and reliability, meeting the industry's dual demands for yield and output.

• Flexible Worktable Configuration: Applicable to 4-inch and 6-inch wafers with wafer thickness variation of less than 15μm. Worktable size of 168mm / 260mm and 290° rotation meets diverse cutting requirements.

Its dual-stage design delivers near-zero idle time during production. Integrated multi-scan laser capability dramatically boosts throughput, with micron-level cut depth control that automatically compensates for wafer thickness variation. The non-contact laser process minimizes thermal impact and chipping, preserving die strength and elevating overall yield for ultra-small chip separation.

ASM LS100-2 Machine Information