The ASM LS100-2 is an advanced laser dicing system built specifically for high-volume singulation of Mini LED and Micro LED wafers. It supports 4-inch and 6-inch substrates, leveraging patented semi-surface dicing (SSD) technology to create controlled pre-cuts for subsequent cleaving processes.
Its dual-stage design delivers near-zero idle time during production. Integrated multi-scan laser capability dramatically boosts throughput, with micron-level cut depth control that automatically compensates for wafer thickness variation. The non-contact laser process minimizes thermal impact and chipping, preserving die strength and elevating overall yield for ultra-small chip separation.
ASM LS100-2 Machine Information
| Manufacturer | ASM / ASMPT |
|---|---|
| Model | LS100-2 |
| Equipment Type | Automatic laser scribing and wafer-processing system |
| Primary Application | Laser scribing and compatible cutting processes for semiconductor or LED substrates |
| Workpiece Compatibility | Determined by the substrate material, wafer format, thickness, street layout and installed laser configuration |
| Condition | Pre-owned semiconductor laser-processing equipment |
| Actual Configuration | Confirmed according to the specific machine available |
| Delivery Scope | Based on the quotation and confirmed equipment list |
| Support | Initial fault review, parts matching and repair discussion |
| Shipping | Export packing and worldwide delivery |
