High wire throughput and fine pad pitch define packaging productivity. The ASM AB550 automatic thermosonic wire bonder delivers a bonding speed of up to 9 wires per second, supporting pad pitch down to 68µm and minimum pad size of 63µm × 80µm.
Its patented PR On The Fly vision recognition cuts pattern recognition time by up to 48%. The expanded 100mm diameter bonding area handles large substrates and multi-up PCB strips efficiently. Optimized rotary motion control preserves precision even with expanded travel range.
It supports gold, copper and silver wire processes for RFID, COB and compact IC packages. The compact footprint and simplified maintenance keep uptime high during continuous mass production.
Technical Specifications (Typical Configuration)
| Parameter | Specification |
|---|---|
| System Type | Fully automatic thermosonic wire bonder |
| Supported Wire Materials | Gold (Au), Copper (Cu), Palladium-Coated Copper (PCC) |
| Bonding Accuracy | ±2.0 μm to ±3.0 μm @ 3σ (process dependent) |
| Wire Diameter Range | 15 μm – 50 μm (0.6–2.0 mil) |
| Substrate Types | Leadframes, organic laminates, strip carriers |
| Production Focus | High-volume manufacturing (high UPH / stable yield) |
