The ASM AB550 automatic ultrasonic wire bonder offers high throughput and fine-pitch interconnection capabilities, featuring a large effective bonding area of up to Ø100 mm and supporting various carriers such as leadframes, panel substrates, and multi-chip arrays.
The AB550 achieves bonding speeds of up to 9 wires per second and handles fine bonding geometries (minimum bond pad size of 63×80 μm and a pitch of 68 μm). Compatible with gold, copper, and aluminum wires, it is suitable for applications including COB, CIS sensors, RF modules, power discrete devices, and MCM packaging.
Equipped with patented vision alignment technology, a high-rigidity damped worktable, and an adaptive ultrasonic control system, the machine ensures a placement accuracy of ±0.8 μm (@3σ). Its maintenance-free motion structure minimizes downtime, making it a reliable workhorse for large-scale semiconductor assembly and equipment fleet deployments.
Summary Parameters
| Item | Specification |
|---|---|
| Bonding speed | 9 wires/sec |
| Minimum bond pad | 63 µm × 80 µm |
| Minimum pad pitch | 68 µm |
| Effective bonding radius | 230 mm |
| Worktable capacity | approx. 1.75× larger than AB530 |
| Load/unload cycle | 4 sec on 30 × 30 mm PCB |
